Electroplating apparatus

Abstract

An electroplating apparatus is adapted to electroplate an object to be plated having through holes. The electroplating apparatus includes a plating tank, a first anode plate parallel to a second anode plate in the plating tank, a cathode plate connected to the object to be plated, a first sensing module, and a second sensing module. The cathode plate and the object to be plated are in the plating tank and between the first anode plate and the second anode plate. The first sensing module includes a light source between the object to be plated and the first anode plate, and a light sensor between the object to be plated and the second anode plate. The second sensing module includes a first electrical sensor between the object to be plated and the first anode plate, and a second electrical sensor between the object to be plated and the second anode plate.

What is claimed is: 
     
         1 . An electroplating apparatus, adapted to electroplate an object to be plated having a plurality of through holes, wherein the electroplating apparatus comprises:
 a plating tank;   a first anode plate;   a second anode plate, disposed in the plating tank in parallel with the first anode plate;   a cathode plate, connected to the object to be plated, wherein the cathode plate and the object to be plated are disposed in the plating tank and located between the first anode plate and the second anode plate;   a first sensing module, disposed in the plating tank, located between the first anode plate and the second anode plate, wherein the first sensing module comprises:
 a light source, disposed between the object to be plated and the first anode plate; and 
 a light sensor, disposed between the object to be plated and the second anode plate; and 
   a second sensing module, disposed in the plating tank, located between the first anode plate and the second anode plate, wherein the second sensing module comprises:
 a first electrical sensor, disposed between the object to be plated and the first anode plate; and 
 a second electrical sensor, disposed between the object to be plated and the second anode plate. 
   
     
     
         2 . The electroplating apparatus according to  claim 1 , further comprising:
 an eccentric swing module, disposed above the plating tank and connected to the cathode plate.   
     
     
         3 . The electroplating apparatus according to  claim 2 , wherein the eccentric swing module comprises:
 a motor;   a driving rod, connected to the motor, wherein the driving rod is adapted to be driven by the motor to rotate around an axis; and   a connecting rod, wherein the driving rod is connected to the cathode plate through the connecting rod, and the connecting rod, the cathode plate, and the object to be plated are adapted to rotate around the axis synchronously with the driving rod.   
     
     
         4 . The electroplating apparatus according to  claim 3 , wherein an eccentric distance is between the driving rod and the axis, and the eccentric distance is 1/10 to ½ times a distance from an edge of the object to be plated to a center of the object to be plated. 
     
     
         5 . The electroplating apparatus according to  claim 3 , wherein the driving rod is parallel to the axis and perpendicular to the connecting rod. 
     
     
         6 . The electroplating apparatus according to  claim 1 , further comprising:
 a first positioning bracket; and   a second positioning bracket, disposed in the plating tank in parallel with the first positioning bracket, and the cathode plate is clamped and positioned between the first positioning bracket and the second positioning bracket, wherein the first positioning bracket is located between the first anode plate and the cathode plate, and the second positioning bracket is located between the second anode plate and the cathode plate.   
     
     
         7 . The electroplating apparatus according to  claim 6 , wherein the light source is connected to a side of the first positioning bracket facing the object to be plated, and the light sensor is connected to a side of the second positioning bracket facing the object to be plated. 
     
     
         8 . The electroplating apparatus according to  claim 6 , wherein the first electrical sensor is connected to a side of the first positioning bracket facing the object to be plated, and the second electrical sensor is connected to a side of the second positioning bracket facing the object to be plated. 
     
     
         9 . The electroplating apparatus according to  claim 1 , wherein the first anode plate is separated from the cathode plate by a first distance, and the second anode plate is separated from the cathode plate by a second distance equal to the first distance. 
     
     
         10 . The electroplating apparatus according to  claim 9 , wherein the first distance is between 3 cm and 10 cm. 
     
     
         11 . The electroplating apparatus according to  claim 1 , further comprising:
 a plurality of first nozzles, disposed in the plating tank and connected to the first anode plate; and   a plurality of second nozzles, disposed in the plating tank and connected to the second anode plate.   
     
     
         12 . The electroplating apparatus according to  claim 11 , wherein the first nozzles are connected to a side of the first anode plate facing the cathode plate, and the second nozzles are connected to a side of the second anode plate facing the cathode plate. 
     
     
         13 . The electroplating apparatus according to  claim 11 , wherein the cathode plate, the object to be plated, the first sensing module, and the second sensing module are located between the first nozzles and the second nozzles. 
     
     
         14 . The electroplating apparatus according to  claim 11 , wherein the first nozzles have different depths from a liquid level of the plating tank to be arranged in a plurality of rows on the first anode plate, and the second nozzles have different depths from the liquid surface of the plating tank to be arranged in a plurality of rows on the second anode plate. 
     
     
         15 . The electroplating apparatus according to  claim 14 , further comprising:
 a plurality of first flow meters, disposed corresponding to the first nozzles in different rows, and the first nozzles in the same row are connected to the same first flow meter; and   a plurality of second flow meters, disposed corresponding to the second nozzles in different rows, and the second nozzles in the same row are connected to the same second flow meter.   
     
     
         16 . The electroplating apparatus according to  claim 12 , wherein each of the first nozzles and each of the second nozzles has a jet opening facing the object to be plated respectively, each of the jet openings is provided with a nozzle sheet, and each of the nozzle sheets has a plurality of jet holes. 
     
     
         17 . The electroplating apparatus according to  claim 1 , wherein the first electrical sensor and the second electrical sensor are reference electrodes, and comprise silver/silver chloride electrodes, calomel electrodes, or saturated mercury/mercurous sulfate electrodes. 
     
     
         18 . The electroplating apparatus according to  claim 1 , further comprising:
 at least one row of bottom nozzles, disposed at a bottom of the plating tank, located between the first anode plate and the cathode plate or between the second anode plate and the cathode plate.   
     
     
         19 . The electroplating apparatus according to  claim 1 , wherein an inert gas injection port is disposed at a bottom of the plating tank, and is located between the first anode plate and the second anode plate. 
     
     
         20 . The electroplating apparatus according to  claim 19 , wherein the object to be plated is located between the cathode plate and the inert gas injection port, and at least a portion of the inert gas injection port falls within a projection range of the cathode plate on the bottom of the plating tank.