US2025249547A1PendingUtilityA1
Sub-pad for polishing pad, polishing pad including same, and method for manufacturing sub-pad for polishing pad
Est. expiryApr 14, 2042(~15.7 yrs left)· nominal 20-yr term from priority
B24D 11/001B24B 37/22B24B 37/24B24D 11/00
55
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Claims
Abstract
A sub-pad for a polishing pad is disclosed. The sub-pad is stacked under a top pad that is brought into contact with a wafer to perform polishing, and includes a nanofiber nonwoven fabric pad. The nanofiber nonwoven fabric pad has a nanofiber density of an outer circumferential part that is formed to be 1.2 to 5 times higher than the nanofiber density of other portions inside the outer circumferential part. A polishing pad including the sub-pad and a method for manufacturing the sub-pad for the polishing pad are disclosed.
Claims
exact text as granted — not AI-modified1 . A sub-pad for a polishing pad, the sub-pad being stacked under a top pad that is brought into contact with a wafer to perform polishing, and including a nanofiber nonwoven fabric pad, wherein the nanofiber nonwoven fabric pad has a nanofiber density of an outer circumferential part that is formed to be 1.2 to 5 times higher than the nanofiber density of other portions inside the outer circumferential part.
2 . The sub-pad for the polishing pad according to claim 1 ,
wherein the nanofiber density of the outer circumferential part is 1.5 to 5 times higher than the nanofiber density of other portions inside the outer circumferential part.
3 . The sub-pad for the polishing pad according to claim 1 ,
wherein the nanofiber nonwoven fabric pad includes a hydrophobic polymer.
4 . The sub-pad for the polishing pad according to claim 3 ,
wherein the hydrophobic polymer is at least one selected from a group consisting of polystyrene and Teflon (PTFE, Polytetrafluoroethylene).
5 . The sub-pad for the polishing pad according to claim 1 ,
wherein the outer circumferential part of the sub-pad functions to prevent penetration of a polishing slurry due to a low porosity.
6 . A polishing pad, comprising:
a top pad that is brought into contact with a wafer to perform polishing; and the sub-pad of claim 1 stacked under the top pad.
7 . The polishing pad according to claim 6 ,
wherein a cross section of the outer circumferential part of the sub-pad is exposed to the outer circumferential surface of the polishing pad.
8 . A method for manufacturing the sub-pad for the polishing pad of claim 1 , the method comprising the steps of:
a) electrospinning a polymer solution; b) recovering the nanofiber nonwoven fabric formed by the electrospinning; and c) thermally compressing the nanofiber nonwoven fabric, wherein the collector during electrospinning of the step a) includes a circular electrode corresponding to the outer circumferential part of the sub-pad.
9 . The method for manufacturing the sub-pad for the polishing pad according to claim 8 ,
wherein the collector includes an electrospinning-induced film, and the circular electrode is formed on the surface of the electrospinning-induced film.
10 . The method for manufacturing the sub-pad for the polishing pad according to claim 9 ,
wherein the circular electrode is printed on the surface of the electrospinning-induced film.
11 . The method for manufacturing the sub-pad for the polishing pad according to claim 9 ,
wherein two or more nanofiber nonwoven fabrics recovered in the step b) are stacked such that high density portions of the nanofiber formed on the top of a circular electrode overlap each other, and the stacked nanofiber nonwoven fabrics are thermally compressed in the step c).
12 . The method for manufacturing the sub-pad for the polishing pad according to claim 9 ,
wherein a plurality of circular electrodes are formed on the surface of electrospinning-induced films, and the plurality of circular electrodes are electrically connected by a conductive material, the electrospinning-induced film collects nanofibers spun while moving horizontally, or the electrospinning-induced film collects nanofibers spun while rotating in the state of being wound around a circular drum.Join the waitlist — get patent alerts
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