Polishing Pad

Abstract

The present invention provides a polishing pad that can polish a material to be polished at a high polishing rate in a polishing process, and can be stably dressed. The polishing pad contains a hydrogenated block copolymer (I) which is in an amount of 5% by mass or more, and which satisfies the following conditions (1) and (2), and which has a value of a static friction coefficient measured in accordance with JIS K7125 of 1.2 or less. <Condition (1)>: The hydrogenated block copolymer (I) is a hydrogenated product of a block copolymer containing a vinyl aromatic monomer unit, and a conjugated diene monomer unit. <Condition (2)>: The hydrogenated block copolymer (I) contains at least one polymer block (a) principally containing a vinyl aromatic monomer unit, and a content of the polymer block (a) principally containing a vinyl aromatic monomer unit in the hydrogenated block copolymer (I) is 10% by mass or more.

What is claimed is: 
     
         1 . A polishing pad comprising a hydrogenated block copolymer (I) which is in an amount of 5% by mass or more, and which satisfies the following conditions (1) and (2), and which has a value of a static friction coefficient measured in accordance with JIS K7125 of 1.2 or less.
 <Condition (1)>   the hydrogenated block copolymer (I) is a hydrogenated product of a block copolymer containing a vinyl aromatic monomer unit, and a conjugated diene monomer unit; and   <Condition (2)>   the hydrogenated block copolymer (I) contains at least one polymer block (a) principally containing a vinyl aromatic monomer unit, and a content of the polymer block (a) principally containing a vinyl aromatic monomer unit in the hydrogenated block copolymer (I) is 10% by mass or more.   
     
     
         2 . The polishing pad according to  claim 1 ,
 wherein the hydrogenated block copolymer (I) contains at least one hydrogenated copolymer block (b) containing a vinyl aromatic monomer unit, and a conjugated diene monomer unit, and   a content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 5% by mass or more and 79% by mass or less.   
     
     
         3 . The polishing pad according to  claim 2 , wherein the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 45% by mass or more and 79% by mass or less. 
     
     
         4 . The polishing pad according to  claim 1 , wherein the polishing pad comprises the hydrogenated block copolymer (I) in an amount of 40% by mass or more. 
     
     
         5 . The polishing pad according to  claim 1 , wherein the polishing pad comprises the hydrogenated block copolymer (I) in an amount of 70% by mass or more. 
     
     
         6 . The polishing pad according to  claim 1 , wherein the polishing pad has a value of a dynamic friction coefficient measured in accordance with JIS K7125 of 0.6 or less. 
     
     
         7 . The polishing pad according to  claim 1 , wherein the content of the polymer block (a) principally containing the vinyl aromatic monomer unit in the hydrogenated block 10 copolymer (I) is 15% by mass or more and 40% by mass or less.