Electroless plating method

Abstract

An electroless plating method includes the following steps. An object to be plated is provided, wherein the object to be plated is a metal material. A cleaning process is performed on the object to be plated to remove impurities on a surface of the object to be plated. A plasma treatment process is performed on the surface of the object to be plated to ionize a metal of the surface of the object to be plated. The object to be plated after the plasma treatment process is immersed in a chemical plating solution to form a plating layer.

What is claimed is: 
     
         1 . An electroless plating method, comprising:
 providing an object to be plated, wherein the object to be plated is a metal material;   performing a cleaning process on the object to be plated to remove impurities on a surface of the object to be plated;   performing a plasma treatment process on the surface of the object to be plated to ionize a metal of the surface of the object to be plated; and   immersing the object to be plated after the plasma treatment process in a chemical plating solution to form a plating layer.   
     
     
         2 . The electroless plating method of  claim 1 , wherein after the plasma treatment process of the object to be plated, the object to be plated is immersed in the chemical plating solution. 
     
     
         3 . The electroless plating method of  claim 1 , wherein a process gas of the plasma treatment process comprises an oxygen gas and/or an argon gas, so that the surface of the object to be plated is exposed to a plasma environment generated by the process gas. 
     
     
         4 . The electroless plating method of  claim 1 , wherein before the object to be plated is immersed in the chemical plating solution, the surface of the object to be plated is not activated by a catalyst. 
     
     
         5 . The electroless plating method of  claim 1 , wherein a material of the object to be plated comprises gold, silver, platinum, palladium, rhodium, nickel, cobalt, or an alloy thereof. 
     
     
         6 . The electroless plating method of  claim 1 , wherein the chemical plating solution comprises a metal salt, and the metal salt comprises a nickel ion, a chromium ion, a gold ion, a tin ion, or a copper ion. 
     
     
         7 . The electroless plating method of  claim 1 , wherein the cleaning process comprises a wet chemical cleaning method or a plasma cleaning method. 
     
     
         8 . The electroless plating method of  claim 7 , wherein a cleaning solution used in the wet chemical cleaning method comprises hydrochloric acid, sulfuric acid, hydrogen peroxide, ammonia, dilute hydrofluoric acid, organic acid, sodium hydroxide, or a combination thereof. 
     
     
         9 . The electroless plating method of  claim 7 , wherein the cleaning process is a plasma cleaning method, and the cleaning process and the plasma treatment process are performed in a same process step. 
     
     
         10 . The electroless plating method of  claim 1 , wherein the object to be plated is formed on a substrate, and a material of the substrate comprises a quartz, a glass, a resin, or a semiconductor.