An aerosol provision system

Abstract

An aerosol provision system has a pressure sensing apparatus including a circuit board and a pressure sensor. A first side of the pressure sensor is in fluid communication with a mouthpiece of the aerosol provision system and a second side of the pressure sensor is in fluid communication with ambient air. The pressure sensor is mounted on the circuit board to provide the fluid communication to the first side or the second side. The circuit board has a hole to provide the fluid communication to the other of the first side and the second side of the pressure sensor.

1 . An aerosol provision system comprising:
 an air flow and/or pressure sensing apparatus comprising a circuit board and an air flow sensor and/or a pressure sensor;   wherein a first side of the air flow sensor and/or pressure sensor is in fluid communication with a mouthpiece of the aerosol provision system and a second side of the air flow sensor and/or pressure sensor is in fluid communication with ambient air;   the air flow sensor and/or pressure sensor is mounted on the circuit board to provide the fluid communication to the first side or the second side; and   the circuit board has a hole to provide the fluid communication to the other of the first side and the second side of the air flow sensor and/or pressure sensor.   
     
     
         2 . The aerosol provision system according to  claim 1 , wherein:
 the air flow sensor and/or pressure sensor is a differential pressure sensor configured to measure a pressure difference between a pressure on the first side of the pressure sensor and a pressure on the second side of the pressure sensor.   
     
     
         3 . The aerosol provision system according to  claim 1 , wherein:
 the air flow sensor and/or pressure sensor is a micro electro-mechanical system (MEMS) sensor.   
     
     
         4 . The aerosol provision system according to  claim 1 , the aerosol provision system further comprising:
 a seal positioned on an opposite side of the circuit board to the air flow sensor and/or pressure sensor, and providing a seal around the hole.   
     
     
         5 . The aerosol provision system according to  claim 4 , wherein:
 a width of the seal is smaller than a width of the air flow sensor and/or pressure sensor.   
     
     
         6 . A method of manufacturing an aerosol provision system, the method comprising:
 connecting a circuit board to a mouthpiece for the aerosol provision system, wherein the circuit board comprises an air flow sensor and/or a pressure sensor and wherein an input side or an output side of the air flow sensor and/or pressure sensor is mounted to a hole through the circuit board, and wherein after the connecting the output side of the air flow sensor and/or pressure sensor is in fluid communication with the mouthpiece of the aerosol provision system, and the input side of the air flow sensor and/or pressure sensor is in fluid communication with ambient air.   
     
     
         7 . The method of  claim 6 , wherein the connecting further comprising connecting the output side of the air flow sensor and/or pressure sensor to the mouthpiece via a seal that seals an air passage to the output side of the air flow sensor and/or pressure sensor. 
     
     
         8 . The method of  claim 7 , wherein the circuit board comprises a plurality of electrical components attached to a first side thereof, and wherein the seal is provided on a second side of the circuit board. 
     
     
         9 . The method of  claim 7 , wherein the seal is attached to the circuit board prior to the connecting. 
     
     
         10 . The method of  claim 7 , wherein the air passage connects the output side of the air flow sensor and/or pressure sensor to the mouthpiece via the hole through the circuit board. 
     
     
         11 . The method according to  claim 7 , wherein a width of the seal is smaller than a width of the air flow sensor and/or pressure sensor. 
     
     
         12 . The method of  claim 6 , further comprising, prior to the connecting:
 mounting the air flow sensor and/or pressure sensor to the circuit board.   
     
     
         13 . The method of  claim 12 , further comprising, prior to the mounting;
 forming the hole through the circuit board.   
     
     
         14 . The method according to  claim 6 , wherein the air flow sensor and/or pressure sensor is a differential pressure sensor configured to measure a pressure difference between a pressure on the first side of the pressure sensor and a pressure on the second side of the pressure sensor. 
     
     
         15 . The method according to  claim 6 , wherein the air flow sensor and/or pressure sensor is a micro electro-mechanical system (MEMS) sensor. 
     
     
         16 . The method according to  claim 6 , the method further comprising:
 providing a seal on an opposite side of the circuit board to the air flow sensor and/or pressure sensor to seal around the hole.