Polishing apparatus for a substrate

Abstract

A polishing apparatus includes: a platen rotatable; a polishing pad disposed on the platen; a polishing head disposed on the polishing pad; a slurry supply disposed above the polishing pad and configured to supply slurry to the polishing pad; a conditioner disposed above the polishing pad and includes a conditioning disk for polishing a surface of the polishing pad; and a collection module disposed above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad. The collection module includes a collection body, and a collection portion disposed within the collection body, and the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers.

What is claimed is: 
     
         1 . A polishing apparatus for a substrate, comprising:
 a platen rotatable in a direction of rotation;   a polishing pad disposed on the platen;   a polishing head disposed on the polishing pad and configured to rotate a wafer and cause the wafer to contact the polishing pad;   a slurry supply disposed above the polishing pad and spaced apart from the polishing head in the direction of rotation and configured to supply slurry to the polishing pad;   a conditioner disposed above the polishing pad and spaced apart from the slurry supply in the direction of rotation and includes a conditioning disk for polishing an upper surface of the polishing pad; and   a collection module disposed adjacent to the conditioner or the polishing head above the polishing pad and configured to collect polishing pad debris generated on the upper surface of the polishing pad,   wherein the collection module includes a collection body and a collection portion disposed within the collection body, and the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the upper surface of the polishing pad and an adhesive member wound around the at least one pair of collection rollers.   
     
     
         2 . The polishing apparatus of  claim 1 , wherein the collection body includes a groove recessed from a lower surface of the collection body toward an upper surface of the collection body, and the collection portion is disposed to overlap the groove. 
     
     
         3 . The polishing apparatus of  claim 2 , wherein the collection module further includes an auxiliary roller disposed on the lower surface of the collection body and rotatable with respect to the axis parallel to the upper surface of the polishing pad, and the auxiliary roller is disposed closer to the polishing pad than it is to a lower extent of the groove of the collection body. 
     
     
         4 . The polishing apparatus of  claim 2 , wherein the collection module further includes a first electrode and a second electrode having different polarities, and the first electrode and the second electrode are spaced apart from each other with the adhesive member interposed therebetween. 
     
     
         5 . The polishing apparatus of  claim 1 , wherein an end of the adhesive member is disposed at the same level as that of a lower surface of the collection body or is disposed at a higher level than that of the lower surface of the collection body. 
     
     
         6 . The polishing apparatus of  claim 1 , wherein the collection portion includes a plurality of collectors, and the plurality of collectors surround at least a portion of the conditioning disk. 
     
     
         7 . The polishing apparatus of  claim 6 , wherein the conditioner further includes a disk holder supporting the conditioning disk, the collection body is coupled to the disk holder, and the plurality of collectors surround the conditioning disk. 
     
     
         8 . The polishing apparatus of  claim 6 , wherein the collection body has an arc shape, and the plurality of collectors surround a portion of the conditioning disk. 
     
     
         9 . The polishing apparatus of  claim 8 , wherein the collection module is disposed above the polishing pad and is located between the slurry supply and the conditioner based on the direction of rotation. 
     
     
         10 . The polishing apparatus of  claim 8 , wherein the collection module is disposed above the polishing pad between the conditioner and the polishing head based on the direction of rotation. 
     
     
         11 . The polishing apparatus of  claim 1 , wherein the collection body has an elongated bar shape in a length direction, and the collection portion includes a plurality of collectors disposed along the length direction of the collection body. 
     
     
         12 . The polishing apparatus of  claim 11 , wherein the collection module is disposed above the polishing pad and is located between the conditioner and the polishing head based on the direction of rotation. 
     
     
         13 . The polishing apparatus of  claim 12 , wherein the conditioner further includes a conditioner arm configured to rotate the conditioning disk, and the collection body is coupled to the conditioner arm. 
     
     
         14 . The polishing apparatus of  claim 1 , wherein the adhesive member includes at least one of 3,4-dihydroxy-I-phenylalanine (Peptidyl-DOPA), Mussel Foot Protein (MFP), a hyperbranched polymer adhesive (HBPA), 3,4,5-trihydroxyphenylalanine (TOPA), polydimethylsiloxane (PMDS), and catechol. 
     
     
         15 . The polishing apparatus of  claim 1 , wherein the conditioning disk includes a disk pad, a plurality of protruding portions disposed on a lower surface of the disk pad, and a coating layer coated on the lower surface of the disk pad and the plurality of protruding portions, and the coating layer includes an adhesive material. 
     
     
         16 . A polishing apparatus for a substrate, comprising:
 a platen rotatable in a direction of rotation;   a polishing pad disposed on the platen;   a polishing head disposed on the polishing pad and configured to rotate a wafer and cause the wafer to contact the polishing pad;   a slurry supply disposed above the polishing pad, spaced apart from the polishing head in the direction of rotation, and configured to supply slurry to the polishing pad;   a conditioner disposed above the polishing pad, spaced apart from the slurry supply in the direction of rotation, and includes a conditioning disk for polishing a surface of the polishing pad; and   a collection module disposed adjacent to the polishing head above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad,   wherein the collection module includes a collection body and a collection portion disposed within the collection body, the collection portion includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers, and the collection portion includes a plurality of collectors surrounding at least a portion of the polishing head.   
     
     
         17 . The polishing apparatus of  claim 16 , wherein the polishing head includes a retainer ring disposed on the polishing pad and surrounding the wafer, and a polishing head main body disposed on the retainer ring, the collection body is coupled to the polishing head, and the plurality of collectors surround the polishing head. 
     
     
         18 . The polishing apparatus of  claim 16 , wherein the collection body has an arc shape, and the plurality of collectors surround a portion of the polishing head. 
     
     
         19 . The polishing apparatus of  claim 18 , wherein the collection module is disposed above the polishing pad and is either between the conditioner and the polishing head based on the direction of rotation or is between the polishing head and the slurry supply based on the direction of rotation. 
     
     
         20 . A polishing apparatus for a substrate, comprising:
   10  a platen rotatable in a direction of rotation;   a polishing pad disposed on the platen;   a polishing head disposed on the polishing pad and configured to rotate a wafer and cause the wafer to contact the polishing pad;   a slurry supply disposed above the polishing pad, spaced apart from the polishing head in the direction of rotation, and configured to supply slurry to the polishing pad;   a conditioner disposed above the polishing pad, spaced apart from the slurry supply in the direction of rotation, and includes a conditioning disk for polishing a surface of the polishing pad; and   a collection module disposed adjacent to the conditioner above the polishing pad and configured to collect polishing pad debris generated on the surface of the polishing pad,   wherein the collection module includes a collection body including a groove recessed from a lower surface thereof toward an upper surface thereof, a collection portion that includes at least one pair of collection rollers rotatable with respect to an axis parallel to the polishing pad and an adhesive member wound around the at least one pair of collection rollers and is disposed to overlap the groove of the collection body, a collection portion support portion that connects the collection body and the at least one pair of collection rollers, and an auxiliary roller disposed on the lower surface of the collection body and configured to rotate with respect to the axis parallel to the polishing pad, and the collection portion includes a plurality of collectors surrounding at least a portion of the conditioning disk.