US2025290216A1PendingUtilityA1

Plating film manufacturing method

Assignee: OKUNO CHEM IND COPriority: May 19, 2022Filed: Mar 30, 2023Published: Sep 18, 2025
Est. expiryMay 19, 2042(~15.8 yrs left)· nominal 20-yr term from priority
C25D 3/12C25D 3/06C25D 5/611C25D 5/50C25D 3/16C25D 3/18C25D 5/14C25D 5/12
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Claims

Abstract

An object of the present invention is to provide a method for producing a plating film that can impart excellent corrosion resistance to an object on which a trivalent-chromium plating film is formed, and that can form a trivalent-chromium plating film with excellent brightness. The present invention includes step 1 of forming an electrolytic nickel plating film and step 2 of forming an electrolytic trivalent-chromium plating film on the electrolytic nickel plating film, wherein the electrolytic nickel plating film has a compressive stress of 0 to 100 MPa.

Claims

exact text as granted — not AI-modified
1 . A method for producing a plating film, comprising
 step 1 of forming an electrolytic nickel plating film, and   step 2 of forming an electrolytic trivalent-chromium plating film on the electrolytic nickel plating film,   
       wherein
 the electrolytic nickel plating film has a compressive stress of 0 to 100 MPa, 
 the electrolytic trivalent-chromium plating film has a tensile stress of 0 to 50 MPa, and 
 the electrolytic trivalent-chromium plating film has a thickness of 5 μm or more. 
 
     
     
         2 . The method according to  claim 1 , wherein the electrolytic trivalent-chromium plating film has an arithmetic mean roughness Ra of 0.080 μm or less. 
     
     
         3 . The method according to  claim 1 , wherein the electrolytic trivalent-chromium plating film has a thickness of 200 μm or less. 
     
     
         4 . The method according to  claim 1 , wherein the electrolytic trivalent-chromium plating film has a Vickers hardness of 750 HV or more. 
     
     
         5 . The method according to  claim 1 , wherein step 2 is a step of intermittently forming an electrolytic trivalent-chromium plating film. 
     
     
         6 . The method according to  claim 1 , wherein the electrolytic nickel plating film has a thickness of 5 μm or more and 50 μm or less.

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