US2025290216A1PendingUtilityA1
Plating film manufacturing method
Est. expiryMay 19, 2042(~15.8 yrs left)· nominal 20-yr term from priority
C25D 3/12C25D 3/06C25D 5/611C25D 5/50C25D 3/16C25D 3/18C25D 5/14C25D 5/12
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Claims
Abstract
An object of the present invention is to provide a method for producing a plating film that can impart excellent corrosion resistance to an object on which a trivalent-chromium plating film is formed, and that can form a trivalent-chromium plating film with excellent brightness. The present invention includes step 1 of forming an electrolytic nickel plating film and step 2 of forming an electrolytic trivalent-chromium plating film on the electrolytic nickel plating film, wherein the electrolytic nickel plating film has a compressive stress of 0 to 100 MPa.
Claims
exact text as granted — not AI-modified1 . A method for producing a plating film, comprising
step 1 of forming an electrolytic nickel plating film, and step 2 of forming an electrolytic trivalent-chromium plating film on the electrolytic nickel plating film,
wherein
the electrolytic nickel plating film has a compressive stress of 0 to 100 MPa,
the electrolytic trivalent-chromium plating film has a tensile stress of 0 to 50 MPa, and
the electrolytic trivalent-chromium plating film has a thickness of 5 μm or more.
2 . The method according to claim 1 , wherein the electrolytic trivalent-chromium plating film has an arithmetic mean roughness Ra of 0.080 μm or less.
3 . The method according to claim 1 , wherein the electrolytic trivalent-chromium plating film has a thickness of 200 μm or less.
4 . The method according to claim 1 , wherein the electrolytic trivalent-chromium plating film has a Vickers hardness of 750 HV or more.
5 . The method according to claim 1 , wherein step 2 is a step of intermittently forming an electrolytic trivalent-chromium plating film.
6 . The method according to claim 1 , wherein the electrolytic nickel plating film has a thickness of 5 μm or more and 50 μm or less.Join the waitlist — get patent alerts
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