Three-dimensional thermal-conductive vapor chamber

Abstract

A three-dimensional thermal-conductive vapor chamber includes: a thermal-conductive plate, a fin plate and a thermal connection structure. The fin plate is connected to the thermal-conductive plate and has thermal conductivity. A cross-section of the thermal-conductive plate and a cross-section of the fin plate are two different planes that intersect with each other. The thermal connection structure is disposed between the thermal-conductive plate and the fin plate, and the fin plate is connected to the thermal-conductive plate through the thermal connection structure. The thermal connection structure connects interiors of the thermal-conductive plate and the fin plate to form an interconnected heat transfer path between the thermal-conductive plate and the fin plate.

What is claimed is: 
     
         1 . A three-dimensional thermal-conductive vapor chamber, comprising:
 a thermal-conductive plate;   a fin plate connected to the thermal-conductive plate and having thermal conductivity, a cross-section of the thermal-conductive plate and a cross-section of the fin plate being two different planes that intersect with each other; and   a thermal connection structure disposed between the thermal-conductive plate and the fin plate, wherein the fin plate is connected to the thermal-conductive plate through the thermal connection structure, and the thermal connection structure connects interiors of the thermal-conductive plate and the fin plate such that an interconnected heat transfer path is formed between the thermal-conductive plate and the fin plate.   
     
     
         2 . The three-dimensional thermal-conductive vapor chamber according to  claim 1 , wherein the thermal connection structure comprises copper powder pillars disposed inside the thermal-conductive plate, and a portion of the fin plate extends into the thermal-conductive plate and is connected to the copper powder pillars. 
     
     
         3 . The three-dimensional thermal-conductive vapor chamber according to  claim 2 , wherein a top of each of the copper powder pillars is provided with a boss portion extending into the fin plate, and a bottom of each of the copper powder pillars is fixed inside the thermal-conductive plate. 
     
     
         4 . The three-dimensional thermal-conductive vapor chamber according to  claim 3 , wherein the fin plate comprises a front plate and a rear plate connected to each other with a gap between the front plate and the rear plate, and the boss portion passes through the gap and extends between the front plate and the rear plate. 
     
     
         5 . The three-dimensional thermal-conductive vapor chamber according to  claim 4 , wherein at least one of the front plate and the rear plate is provided with a plurality of first thermal-conductive columns, and both ends of the first thermal-conductive columns are in contact with the front plate and the rear plate, respectively. 
     
     
         6 . The three-dimensional thermal-conductive vapor chamber according to  claim 2 , wherein the thermal-conductive plate comprises a top plate and a bottom plate, the copper powder pillars are configured to be mounted and clamped between the top plate and the bottom plate, and a portion of the fin plate passes through the top plate and extends between the top plate and the bottom plate. 
     
     
         7 . The three-dimensional thermal-conductive vapor chamber according to  claim 6 , wherein the top plate is provided with a strip-shaped hole, the fin plate passes through the strip-shaped hole and extends between the top plate and the bottom plate, and the fin plate is fixed with the top plate by welding. 
     
     
         8 . The three-dimensional thermal-conductive vapor chamber according to  claim 7 , wherein the fin plate is provided with a mounting step at an end of the fin plate, a bottom of the mounting step extends into the strip-shaped hole, and a top of the mounting step overlaps a top of the strip-shaped hole. 
     
     
         9 . The three-dimensional thermally conductive vapor chamber according to  claim 6 , wherein at least one of the top plate and the bottom plate is provided with a plurality of second thermal-conductive columns, and both ends of the second thermal-conductive columns are in contact with the top plate and the bottom plate, respectively. 
     
     
         10 . The three-dimensional thermally conductive vapor chamber according to  claim 1 , wherein a liquid filling port is provided on a side of the thermal-conductive plate, and the liquid filling port is communicated to the interior of the thermal-conductive plate.