Pressure Measurement and Vibration Feedback System and Method of Operating the Same

Abstract

A pressure measurement and vibration feedback system and an operating method for the system are disclosed. The system is arranged with its touch surface facing downward and sequentially includes a cover plate and a PCB board fixed together by a bonding adhesive. A plurality of integrated sensors and a cushioning layer for preventing excessive pressure are provided on the side of the PCB board facing away from the cover plate, the cushioning layer having a relief notch. The integrated sensors are located in the notch area and protrude above the cushioning layer, each sensor having an integrated sensor circuit. The PCB board side facing away from the cover plate is further provided with symmetrically arranged connectors, each connector being electrically connected one-to-one to a corresponding integrated sensor and further connected to a sensing circuit on the PCB board.

What is claimed is: 
     
         1 . A pressure measurement and vibration feedback system, comprising a cover plate and a PCB board arranged sequentially with a touch surface of the system facing downward, the cover plate and the PCB board being laminated together and fixed by a bonding adhesive, wherein: a plurality of integrated sensors and a cushioning layer for preventing excessive pressure are disposed on a side of the PCB board opposite the cover plate, the cushioning layer having a relief notch; the integrated sensors are distributed in an area corresponding to the relief notch of the cushioning layer, with the thickness of the cushioning layer being smaller than the integrated sensors, each integrated sensor having an integrated sensor circuit; and a plurality of symmetrically arranged connectors are provided on the PCB board, each integrated sensor being electrically connected one-to-one to a respective connector, and the connectors being electrically connected to a sensing circuit on the PCB board. 
     
     
         2 . The system according to  claim 1 , wherein communication interfaces among a touchpad chip, a pressure detection and boost control chip, and an I/O expansion chip are I 2 C interfaces. 
     
     
         3 . The system according to  claim 1 , further comprising a driving circuit including a boost switching and protection circuit, a flyback switching circuit, a feedback circuit, a discharge circuit, a switching circuit, and a PWM switching circuit, wherein: the boost switching and protection circuit, feedback circuit, discharge circuit, and PWM switching circuit are connected to the pressure detection and boost control chip; the flyback switching circuit is connected to the PWM switching circuit; the switching circuit is connected to the I/O expansion chip and integrated sensor circuit; the boost switching and protection circuit output is connected to the flyback switching circuit, and the flyback switching circuit outputs are respectively connected to the feedback circuit and discharge circuit. 
     
     
         4 . The system according to  claim 3 , wherein the boost switching and protection circuit comprises a load switch chip, capacitors, and resistors configured to limit inrush current. 
     
     
         5 . The system according to  claim 3 , wherein the flyback switching circuit comprises a transformer, an N-channel MOSFET, diodes, capacitors, and resistors, configured to generate a boosted voltage for the integrated sensors. 
     
     
         6 . The system according to  claim 3 , wherein the feedback circuit comprises a voltage divider formed by series resistors connected to a feedback input of the pressure detection and boost control chip. 
     
     
         7 . The system according to  claim 3 , wherein the discharge circuit comprises an NPN transistor and resistors configured to discharge stored energy rapidly. 
     
     
         8 . The system according to  claim 3 , wherein the switching circuit includes multiple identical switching units, each unit paired with one integrated sensor. 
     
     
         9 . The system according to  claim 8 , wherein each switching unit comprises an NPN transistor whose base is connected through a resistor to the I/O expansion chip, and whose collector connects to an electrode of an integrated sensor circuit. 
     
     
         10 . The system according to  claim 3 , wherein the PWM switching circuit includes an analog switch chip configured to route PWM signals from the pressure detection and boost control chip to different circuit paths for boosting and discharging. 
     
     
         11 . The system according to  claim 10 , wherein the pressure detection and boost control chip selects the boosting or discharging path by toggling a PWM_SW control signal. 
     
     
         12 . A method for operating the pressure measurement and vibration feedback system according to  claim 1 , comprising: calibrating and zeroing baseline pressure values upon system power-up; monitoring pressure slowly when no finger is detected on the cover plate, using multiple differential voltage readings; rapidly sampling pressure values when a finger touch is detected, identifying sensors under the finger contact area; determining vibration feedback based on measured pressure and predefined vibration levels; outputting vibration feedback signals via a PWM switching circuit to drive integrated sensors acting as actuators. 
     
     
         13 . The method according to  claim 12 , wherein the finger touch and release actions generate distinct vibration feedback signals. 
     
     
         14 . The method according to  claim 12 , wherein the pressure detection and boost control chip maintains a virtual button press signal when finger pressure exceeds a preset threshold continuously. 
     
     
         15 . The method according to  claim 12 , wherein the release of finger pressure below a threshold triggers a distinct release vibration effect. 
     
     
         16 . The method according to  claim 12 , further comprising dynamically recalibrating sensor baselines when finger pressure is not detected. 
     
     
         17 . The method according to  claim 12 , wherein the PWM switching circuit allows time-division multiplexing of a single PWM output to handle boosting and discharging processes. 
     
     
         18 . The method according to  claim 12 , wherein sensor selection for vibration feedback is based on the highest pressure values detected by integrated sensors. 
     
     
         19 . The method according to  claim 12 , further comprising a factory calibration step for determining baseline outputs and sensitivity adjustments for each integrated sensor. 
     
     
         20 . The method according to  claim 12 , wherein vibration intensity varies proportionally with the detected finger pressure.