Coated substrate

Abstract

A novel coated substrate which can be applied to various fields and can be mass-produced is provided. A coated substrate has a substrate coated with a film. The thickness of the film is 1 nm or greater and less than 800 nm. X-ray photoelectron spectroscopic measurement of the film shows that the total percent element composition of a metal element and O (oxygen) is 70 atm % or greater. The relative density of the film is 90% or greater. The coated substrate satisfies at least one of the following conditions (1) and (2). Condition (1): the maximum thickness of the film formed on an edge region of a surface of the substrate is greater than the thickness of the film formed on an inner region of the surface located inward of the edge region. Condition (2): the maximum thickness of the film formed on a convex portion present region of the surface of the substrate is greater than the thickness of the film formed on a convex portion absent region of the surface.

What is claimed is: 
     
         1 . A coated substrate in which a substrate is coated with a film, wherein
 the thickness of the film is 1 nm or greater and less than 800 nm,   x-ray photoelectron spectroscopic measurement of the film shows that the total percent element composition of a metal element and O (oxygen) is 70 atm % or greater,   the relative density of the film is 90% or greater, and   at least one of the following conditions (1) and (2) is satisfied;   condition (1): the maximum thickness of the film formed on an edge region of a surface of the substrate is greater than the thickness of the film formed on an inner region of the surface located inward of the edge region, and   condition (2): the maximum thickness of the film formed on a convex portion present region of the surface of the substrate is greater than the thickness of the film formed on a convex portion absent region of the surface.   
     
     
         2 . The coated substrate according to  claim 1 , wherein a portion of the substrate where the film is formed is electrically conductive. 
     
     
         3 . The coated substrate according to  claim 1 , wherein the x-ray photoelectron spectroscopic measurement of the film shows that the percent element composition of C (carbon) is 0.1 atm % or greater and less than 20 atm %. 
     
     
         4 . The coated substrate according to  claim 1 , wherein the film is amorphous. 
     
     
         5 . The coated substrate according to  claim 1 , wherein the condition (1) is such that the maximum thickness of the film formed on the edge region is greater than the thickness of the film formed on the inner region by 10% or more of the thickness of the film formed on the inner region. 
     
     
         6 . The coated substrate according to  claim 1 , wherein the condition (2) is such that the maximum thickness of the film formed on the convex portion present region is greater than the thickness of the film formed on the convex portion absent region by 10% or more of the thickness of the film formed on the convex portion absent region. 
     
     
         7 . The coated substrate according to  claim 1 , wherein the condition (1) is such that the thickness of the film decreases toward the inner region from a position where the film formed on the edge region has the maximum thickness. 
     
     
         8 . The coated substrate according to  claim 1 , wherein the condition (2) is such that the thickness of the film decreases toward the convex portion absent region from a position where the film formed on the convex portion present region has the maximum thickness. 
     
     
         9 . The coated substrate according to  claim 1 , wherein the metal element is at least one or more metal elements selected from the group consisting of Al (aluminum), Ti (titanium), Mo (molybdenum), Cr (chromium), Mn (manganese), Fe (iron), Co (cobalt), Ni (nickel), Zr (zirconium), V (vanadium), W (tungsten), Ta (tantalum), Nb (niobium), and Sn (tin).