Electroplating fixtures for lamp housing

Abstract

Embodiments disclosed herein relate to electroplating apparatuses used for components in semiconductor processing chambers. In one embodiment, an electroplating device is provided. The electroplating device includes a housing including a first surface and a second surface and a plurality of holes disposed in the housing. The plurality of holes extend from the first surface to the second surface, and are configured to hold a component to be electroplated. The electroplating device further includes a gas inlet connected to an air bladder. The air bladder is disposed between the plurality of holes. The air bladder is configured to cover an outer surface of the component to be electroplated. The electroplating device further includes a cathode connector disposed below the first surface, and a cathode insert connected to the cathode connector. The cathode insert is connected to the plurality of holes and is configured to electrically charge the component.

What is claimed is: 
     
         1 . An electroplating device, comprising:
 a housing comprising a first surface and a second surface;   a plurality of holes disposed in the housing and extending from the first surface to the second surface, the plurality of holes configured to hold a component to be electroplated;   an gas inlet connected to an air bladder, the air bladder disposed between the plurality of holes and configured to cover an outer surface of the component to be electroplated;   a cathode connector disposed below the first surface; and   a cathode insert connected to the cathode connector, the cathode insert connected to the plurality of holes and configured to electrically charge the component.   
     
     
         2 . The electroplating device of  claim 1 , further comprising:
 an anode connected to the first surface and extending into each of the plurality of holes, wherein the anode and the cathode are configured to be charged to electroplate the component in an electrolyte solution.   
     
     
         3 . The electroplating device of  claim 1 , wherein the air bladder comprises a rubber or a molded elastomer. 
     
     
         4 . The electroplating device of  claim 1 , wherein the cathode comprises titanium or copper. 
     
     
         5 . The electroplating device of  claim 2 , wherein the anode comprises titanium. 
     
     
         6 . The electroplating device of  claim 1 , wherein the housing comprises at least one of polytetrafluoroethylene, polyvinylidene fluoride, ethylene tetrafluoroethylene, ethylene-chlorotrifluoroethylene, polychlorotrifluoroethylene, fluorinated ethylene propylene, or perfluoroalkoxy. 
     
     
         7 . The electroplating device of  claim 1 , further comprising a plurality of cover rings disposed in the plurality of holes at the second surface, wherein the cathode insert is configured to cover a first surface of the component, and the cover rings are configured to cover a second surface of the component. 
     
     
         8 . An electroplating device, comprising:
 a housing comprising a first surface and a second surface;   a plurality of holes disposed in the housing and extending from the first surface to the second surface, the plurality of holes configured to hold a component to be electroplated;   a plurality of O-rings disposed in the plurality of holes and configured to cover an outer surface of the component;   a cathode connector disposed below the first surface; and   a cathode insert connected to the cathode connector, the cathode insert connected to the plurality of holes configured to electrically charge the component.   
     
     
         9 . The electroplating device of  claim 8 , further comprising:
 an anode connected to the first surface and extending into each of the plurality of holes, wherein the anode and the cathode are configured to be charged to electroplate the component in an electrolyte solution.   
     
     
         10 . The electroplating device of  claim 8 , wherein the O-rings comprises a fluorocarbon elastomer. 
     
     
         11 . The electroplating device of  claim 8 , wherein the cathode connector and the cathode insert comprises titanium or copper. 
     
     
         12 . The electroplating device of  claim 8 , wherein the housing comprises at least one of polytetrafluoroethylene, polyvinylidene fluoride, ethylene tetrafluoroethylene, ethylene-chlorotrifluoroethylene, polychlorotrifluoroethylene, fluorinated ethylene propylene, or perfluoroalkoxy. 
     
     
         13 . The electroplating device of  claim 8 , wherein the cathode insert is positioned at the first surface of the component and is configured to cover a first surface of the component. 
     
     
         14 . A method of electroplating a component, comprising:
 positioning a plurality of components in a plurality of holes of a electroplating device, the plurality of components comprising:
 an outer surface; 
 an inner surface opposite the outer surface; 
 a top surface; and 
 a bottom surface opposite the top surface; 
   sealing the plurality of components in the electroplating device, wherein the outer surface, the top surface, and the bottom surface are covered by the electroplating device;   submerging the electroplating device in an electrolyte solution;   electrically charging the electrolyte solution via a cathode and an anode disposed in the electroplating device; and   electroplating the inner surface of the plurality of components.   
     
     
         15 . The method of  claim 14 , wherein the electrolyte solution comprises gold. 
     
     
         16 . The method of  claim 14 , wherein sealing the plurality of components comprises filling an air bladder with air, the air bladder expanding to surround the outer surface of the plurality of components in the holes. 
     
     
         17 . The method of  claim 14 , wherein sealing the plurality of components is performed by a plurality of O-rings disposed in the holes, the O-rings blocking the electrolyte solution from contacting the outer surface of the plurality of components. 
     
     
         18 . The method of  claim 14 , wherein the top surface is covered by a cathode insert of the cathode. 
     
     
         19 . The method of  claim 14 , wherein the bottom surface is covered by a cover ring of the electroplating device. 
     
     
         20 . The method of  claim 14 , wherein the inner surface is electroplated with a layer of gold having a thickness of 50 micro inches to 500 micro inches.