System and method for polishing the edge of an electronic device

Abstract

A system for polishing the edge of a mobile device is shown and described. The system includes a robot arm which is configured to grab a mobile device. The robot arm is configured to position the mobile device against at least one polishing wheel of a polishing device using a desired force. The system further includes the use of at least one polishing compound. In some instances, the at least one polishing compound is automatically applied to the at least one polishing wheel. In many of these instances the polishing compound is applied at a specific force and for a specific amount of time, ensuring only a desired amount of compound is applied. The system is contained within a chamber having at least one door configured to allow access to the interior of the chamber.

What is claimed: 
     
         1 . A method of polishing an electronic device comprising:
 inserting an electronic device into a chamber of a polishing system;   enabling the polishing system;   polishing only metallic edges of the electronic device, wherein polishing is completed in a specific predetermined sequence; and   wherein the polishing step includes applying polishing compound to a desired polishing wheel of a polishing machine;   removing the electronic device from the polishing system.   
     
     
         2 . The method of  claim 1 , further comprising determining the type of the electronic device. 
     
     
         3 . The method of  claim 1 , further comprising placing the electronic device in a correct electronic device slot. 
     
     
         4 . The method of  claim 1 , further comprising polishing the electronic device using a plurality of polishing wheel and polishing compound combinations. 
     
     
         5 . The method of  claim 1 , wherein the polishing is conducted using a first polish and a second polish. 
     
     
         6 . The method of  claim 1 , further comprising placing the polishing system into a safe state. 
     
     
         7 . The method of  claim 1 , further comprising entering the electronic device unique identifier into the polishing system. 
     
     
         8 . The method of  claim 1 , wherein the polishing sequence is determined based upon the device type and polishing need. 
     
     
         9 . A method of polishing an electronic device comprising:
 inserting an electronic device into a chamber of a polishing system;   enabling the polishing system;   polishing only metallic edges of the electronic device, wherein polishing is completed in a specific predetermined sequence; and   wherein the polishing step includes using a polishing wheel of a polishing machine which is a dry polishing wheel;   removing the electronic device from the polishing system.   
     
     
         10 . The method of  claim 9 , wherein the polishing sequence is determined based upon the device type and polishing need.