Cavitation surface processing method

Abstract

The cavitation processing method increases the grinding speed of the surface. The cavitation surface processing method, includes: suspending abrasives into processing liquid; immersing a workpiece and a flat spray nozzle into the processing liquid; ejecting a cavitation jet spreading in a plane on a surface of the workpiece while the flat spray nozzle is rotating about an ejection axis; and smoothing the surface of the workpiece to apply a compressive residual stress on the surface of the workpiece.

What is claimed is: 
     
         1 . A cavitation surface processing method, comprising:
 suspending abrasives into processing liquid;   immersing a workpiece and a flat spray nozzle into the processing liquid;   ejecting a cavitation jet spreading in a plane on a surface of the workpiece while the flat spray nozzle is rotating about an ejection axis; and   smoothing the surface of the workpiece to apply a compressive residual stress on the surface of the workpiece.   
     
     
         2 . The cavitation surface processing method according to  claim 1 , wherein
 the flat spray nozzle rotates at 100 to 200 RPM.   
     
     
         3 . The cavitation surface processing method according to  claim 1 , further comprising:
 ejecting, from the flat spray nozzle, the cavitation jet having a spray angle of 5 to 10 degrees about the ejection axis.   
     
     
         4 . The cavitation surface processing method according to  claim 1 , further comprising:
 ejecting, from the flat spray nozzle, the cavitation jet having an ejection pressure of 50 MPa to 200 MPa.   
     
     
         5 . The cavitation surface processing method according to  claim 1 , wherein
 the workpiece includes a target surface, and   the ejection axis extends perpendicular to the target surface.   
     
     
         6 . The cavitation surface processing method according to  claim 1 , wherein
 the workpiece includes a target hole, and   the ejection axis extends in a direction in which the target hole extends.   
     
     
         7 . The cavitation surface processing method according to  claim 1 , wherein
 the processing liquid is ejected in a flat plate shape such that the processing liquid flowing in an inlet is straightened and accelerated to pass a choke and spread along a discharge channel.   
     
     
         8 . The cavitation surface processing method according to  claim 2 , further comprising:
 ejecting, from the flat spray nozzle, the cavitation jet having a spray angle of 5 to 10 degrees about the ejection axis.   
     
     
         9 . The cavitation surface processing method according to  claim 2 , further comprising:
 ejecting, from the flat spray nozzle, the cavitation jet having an ejection pressure of 50 MPa to 200 MPa.   
     
     
         10 . The cavitation surface processing method according to  claim 3 , further comprising:
 ejecting, from the flat spray nozzle, the cavitation jet having an ejection pressure of 50 MPa to 200 MPa.   
     
     
         11 . The cavitation surface processing method according to  claim 2 , wherein
 the workpiece includes a target surface, and   the ejection axis extends perpendicular to the target surface.   
     
     
         12 . The cavitation surface processing method according to  claim 3 , wherein
 the workpiece includes a target surface, and   the ejection axis extends perpendicular to the target surface.   
     
     
         13 . The cavitation surface processing method according to  claim 4 , wherein
 the workpiece includes a target surface, and   the ejection axis extends perpendicular to the target surface.   
     
     
         14 . The cavitation surface processing method according to  claim 2 , wherein
 the workpiece includes a target hole, and   the ejection axis extends in a direction in which the target hole extends.   
     
     
         15 . The cavitation surface processing method according to  claim 3 , wherein
 the workpiece includes a target hole, and   the ejection axis extends in a direction in which the target hole extends.   
     
     
         16 . The cavitation surface processing method according to  claim 4 , wherein
 the workpiece includes a target hole, and   the ejection axis extends in a direction in which the target hole extends.   
     
     
         17 . The cavitation surface processing method according to  claim 5 , wherein
 the workpiece includes a target hole, and   the ejection axis extends in a direction in which the target hole extends.   
     
     
         18 . The cavitation surface processing method according to  claim 2 , wherein
 the processing liquid is ejected in a flat plate shape such that the processing liquid flowing in an inlet is straightened and accelerated to pass a choke and spread along a discharge channel.   
     
     
         19 . The cavitation surface processing method according to  claim 3 , wherein
 the processing liquid is ejected in a flat plate shape such that the processing liquid flowing in an inlet is straightened and accelerated to pass a choke and spread along a discharge channel.   
     
     
         20 . A cavitation surface processing method, comprising:
 ejecting a cavitation jet containing cavities spreading in a helical ribbon shape from a flat spray nozzle rotating about an ejection axis at 100 to 200 RPM, the flat spray nozzle having a spray angle of 5 to 10 degrees about the ejection axis;   entraining abrasives by the cavitation jet to collide with a target surface which is a surface of a workpiece; and   applying a compressive residual stress on the target surface by the cavities being collapsed near the target surface and cavity cloud flowing along the target surface to grind the target surface.