Coil arrangement on a multilayer circuit board, and method for producing a coil arrangement

Abstract

A multilayer circuit board comprising a coil arrangement, the coil arrangement including a first coil having at least two turns, wherein the turns of the first coil are arranged above one another in separate layers of the multilayer circuit board and have the same first diameter; and a second coil having at least two turns, wherein the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have the same second diameter; wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board; and wherein each turn of the turns of the first coil and the turns of the second coil is formed entirely in a respective single plane.

What is claimed is: 
     
         1 . A multilayer circuit board comprising a coil arrangement, the coil arrangement including:
 a first coil having at least two turns, wherein the turns of the first coil are arranged above one another in separate layers of the multilayer circuit board and have a same first diameter; and   a second coil having at least two turns, wherein the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have a same second diameter;   wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board;   wherein each turn of the turns of the first coil is formed entirely in a respective single plane, and wherein each turn of the turns of the second coil is formed entirely in a respective single plane.   
     
     
         2 . The multilayer circuit board according to  claim 1 , wherein the first coil and second coil have a common longitudinal axis. 
     
     
         3 . The multilayer circuit board according to  claim 1 ,
 the coil arrangement further including a third coil having at least two turns, wherein the turns of the third coil are arranged above one another in separate layers of the multilayer circuit board and have a same third diameter;   wherein the turns of the third coil and the turns of at least one of the first coil and the second coil are arranged at least partially in the same layers of the multilayer circuit board; and   wherein each turn of the turns of the third coil is formed entirely in a respective single plane.   
     
     
         4 . The multilayer circuit board according to  claim 1 , wherein all turns of the first coil are arranged in different layers of the multilayer circuit board. 
     
     
         5 . The multilayer circuit board according to  claim 4 , wherein all turns of the first coil are arranged in successive layers of the multilayer circuit board. 
     
     
         6 . The multilayer circuit board according to  claim 1 , wherein all turns of the second coil are arranged in different layers of the multilayer circuit board. 
     
     
         7 . The multilayer circuit board according to  claim 6 , wherein all turns of the second coil are arranged in successive layers of the multilayer circuit board. 
     
     
         8 . The multilayer circuit board according to  claim 1 , wherein all of the turns of at least one of the first coil and second coil are formed as substantially complete turns. 
     
     
         9 . The multilayer circuit board according to  claim 1 , wherein at least one of the first coil and the second coil has a polygonal geometry. 
     
     
         10 . An inductive position sensor comprising the multilayer circuit board according to  claim 1 . 
     
     
         11 . A method for producing a coil arrangement, the method comprising:
 producing a first coil having at least two turns such that the turns of the first coil are arranged above one another in separate layers of a multilayer circuit board and have a same first diameter; and   producing a second coil having at least two turns such that the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have a same second diameter;   wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board; and   wherein each turn of the turns of the first coil are formed entirely in a respective single plane, and wherein each turn of the turns of the second coil are formed entirely in a respective single plane.