Display apparatus
Abstract
A display apparatus is provided in the present disclosure. The display apparatus includes a substrate, a pixel driving circuit disposed on the substrate, a bank disposed on the pixel driving circuit, a first electrode which is disposed on the bank and is connected to the pixel driving circuit, a plurality of solder patterns disposed on the plurality of first electrodes, a micro LED disposed on one solder pattern, among the plurality of solder patterns, a first optical layer which is disposed so as to enclose the micro LED and exposes another solder pattern, among the plurality of solder patterns, and a second electrode which is disposed on the micro LED and the first optical layer and exposes the another solder pattern. Accordingly, a short-circuit defect between the solder pattern and the second electrode may be minimized or reduced.
Claims
exact text as granted — not AI-modified1 . A display apparatus comprising:
a substrate; a pixel driving circuit disposed on the substrate; a bank disposed on the pixel driving circuit; a first electrode disposed on the bank, the first electrode connected to the pixel driving circuit; a plurality of solder patterns disposed on the first electrode; a micro Light-Emitting Diode (LED) disposed on one solder pattern, among the plurality of solder patterns; a first optical layer enclosing the micro LED and exposing another solder pattern, among the plurality of solder patterns; and a second electrode disposed on the micro LED and the first optical layer, the second electrode exposing the another solder pattern.
2 . The display apparatus according to claim 1 , wherein an upper surface of the first optical layer has an inclination between the another solder pattern and the micro LED.
3 . The display apparatus according to claim 1 , wherein the second electrode includes an inclined portion in an area adjacent to the another solder pattern.
4 . The display apparatus according to claim 3 , wherein a height of the inclined portion of the second electrode is lower than a height of the micro LED.
5 . The display apparatus according to claim 1 , further comprising:
a second optical layer which is disposed on the second electrode and is formed of an organic material in which micro particles are dispersed, wherein the second optical layer is in contact with the another solder pattern.
6 . The display apparatus according to claim 5 , wherein the second electrode exposes a part of an upper surface of the first optical layer adjacent to the another solder pattern and the second optical layer is in contact with the part of the upper surface of the first optical layer adjacent to the another solder pattern.
7 . The display apparatus according to claim 5 , further comprising:
a black matrix disposed on the second electrode and the second optical layer, wherein an upper surface of the first optical layer and an upper surface of the black matrix have a concave shape in an area overlapping the another solder pattern and an inclination of the upper surface of the black matrix is gentler than an inclination of the upper surface of the first optical layer.
8 . The display apparatus according to claim 1 , further comprising:
a passivation layer which is disposed so as to enclose the bank and the solder pattern, wherein an end of the second electrode is disposed on the passivation layer.
9 . The display apparatus according to claim 1 , wherein the micro LED includes:
an anode electrode; a first semiconductor layer disposed on the anode electrode; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; and a cathode electrode disposed on the second semiconductor layer.
10 . The display apparatus according to claim 9 , wherein the first electrode is disposed below the micro LED to electrically connect the pixel driving circuit and the anode electrode of the micro LED, the plurality of solder patterns is disposed between the first electrode and the anode electrode, and the first electrode and the anode electrodes are electrically connected by eutectic bonding using the plurality of solder patterns.
11 . A display apparatus comprising:
a substrate including a plurality of sub pixels including a first sub pixel, a second sub pixel, and a third sub pixel; a plurality of pixel driving circuits disposed on the substrate; a plurality of banks which are disposed in the plurality of sub pixels respectively and disposed on the plurality of pixel driving circuits respectively; a plurality of first electrodes disposed on the plurality of banks respectively, the plurality of first electrodes connected to the plurality of pixel driving circuits respectively; a plurality of solder patterns disposed on the plurality of first electrodes in the plurality of sub pixels respectively, each of the plurality of solder patterns including a first sub solder pattern and a second sub solder pattern; a plurality of micro Light-Emitting Diodes (LEDs) including:
one pair of first micro LEDs which are disposed on the first sub solder pattern and the second sub solder pattern, respectively, in the first sub pixel, and emit the same color light;
one second micro LED which is disposed on the second sub solder pattern in the second sub pixel; and
one pair of third micro LEDs which are disposed on the first sub solder pattern and the second sub solder pattern, respectively, in the third sub pixel, and emit the same color light; and
a plurality of second electrodes which are disposed on the plurality of micro LEDs respectively and expose the second sub solder pattern of the second sub pixel.
12 . The display apparatus according to claim 11 , wherein the first sub pixel includes a 1-1-th sub pixel and a 1-2-th sub pixel, the second sub pixel includes a 2-1-th sub pixel and a 2-2-th sub pixel, and the third sub pixel includes a 3-1-th sub pixel and a 3-2-th sub pixel,
a first solder pattern includes a 1-1-th solder pattern disposed in the 1-1-th sub pixel and a 1-2-th solder pattern disposed in the 1-2-th sub pixel, a second solder pattern includes a 2-1-th solder pattern disposed in the 2-1-th sub pixel and a 2-2-th solder pattern disposed in the 2-2-th sub pixel, and a third solder pattern includes a 3-1-th solder pattern disposed in the 3-1-th sub pixel and a 3-2-th solder pattern disposed in the 3-2-th sub pixel.
13 . The display apparatus according to claim 12 , wherein the one second micro LED is disposed on the 2-2-th solder pattern in the 2-2-th sub pixel and the plurality of second electrodes exposes the 2-1-th solder pattern of the 2-1-th sub pixel.
14 . The display apparatus according to claim 13 , wherein the plurality of second electrodes is disposed in an area excluding the 2-1-th sub pixel.
15 . The display apparatus according to claim 13 , wherein the plurality of second electrodes is disposed in only an area excluding an area overlapping the 2-1-th solder pattern in the 2-1-th sub pixel.
16 . The display apparatus according to claim 13 , further comprising:
an optical layer enclosing the plurality of micro LEDs, wherein a height of at least a part of the optical layer disposed in the 2-1-th sub pixel is lower than a height of a part disposed in the 2-2-th sub pixel, the first sub pixel, and the third sub pixel.
17 . The display apparatus according to claim 13 , further comprising:
an optical layer disposed on the plurality of second electrodes, wherein a height of at least a part of the optical layer disposed in the 2-1-th sub pixel is lower than a height of a part disposed in the 2-2-th sub pixel, the first sub pixel, and the third sub pixel.
18 . The display apparatus according to claim 17 , further comprising:
a black matrix disposed on the second electrode and the optical layer, wherein a height of at least a part of the black matrix disposed in the 2-1-th sub pixel is lower than a height of a part disposed in the 2-2-th sub pixel, the second sub pixel, and the third sub pixel.
19 . The display apparatus according to claim 11 , wherein the plurality of micro LEDs includes an anode electrode, a first semiconductor layer disposed on the anode electrode, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a cathode electrode disposed on the second semiconductor layer and has a vertical type structure.
20 . The display apparatus according to claim 19 , wherein the plurality of solder patterns is disposed between the plurality of first electrodes and the anode electrode, and the anode electrode is bonded to the plurality of first electrodes by eutectic bonding using the plurality of solder patterns.Join the waitlist — get patent alerts
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