Substrate processing apparatus

Abstract

A substrate processing apparatus includes a plate configured to rotate a polishing pad, a polishing head on the plate, a slurry supply unit configured to supply slurry onto the polishing pad, and a charging pad, on the polishing pad, adjacent the polishing head. When the polishing pad and the charging pad are in contact with each other, friction charging occurs between the charging pad and the polishing pad.

What is claimed is: 
     
         1 . A substrate processing apparatus comprising:
 a plate configured to rotate a polishing pad;   a polishing head on the plate;   a slurry supply unit configured to supply slurry onto the polishing pad; and   a charging pad, on the polishing pad, adjacent the polishing head,   wherein, when the polishing pad and the charging pad are in contact with each other,   friction charging is occurs between the charging pad and the polishing pad.   
     
     
         2 . The substrate processing apparatus of  claim 1 , wherein the polishing head comprises:
 a polishing head body configured to support a substrate; and   a retainer ring on a lower surface of the polishing head body,   wherein the retainer ring includes grooves on a lower surface of the retainer ring, and   wherein the charging pad is located between the grooves.   
     
     
         3 . The substrate processing apparatus of  claim 2 , wherein the charging pad is on the lower surface of the retainer ring. 
     
     
         4 . The substrate processing apparatus of  claim 2 , wherein the charging pad is inside the retainer ring, and
 wherein a lower surface of the charging pad is coplanar with the lower surface of the retainer ring.   
     
     
         5 . The substrate processing apparatus of  claim 1 , further comprising an external ring structure coupled to the polishing head,
 wherein the external ring structure includes:
 a driving unit on the polishing head; 
 an external ring surrounding an outer side surface of the polishing head; and 
 a connection unit connecting the driving unit and the external ring, and 
   wherein the charging pad is on a lower surface of the external ring.   
     
     
         6 . The substrate processing apparatus of  claim 5 , wherein the polishing head comprises a polishing head body and a retainer ring on a lower surface of the polishing head body,
 wherein the retainer ring and the external ring have the same central axis,   wherein the retainer ring has a first groove on a lower surface of the retainer ring, and   wherein the external ring has a second groove adjacent the charging pad on a lower surface of the external ring.   
     
     
         7 . The substrate processing apparatus of  claim 6 , wherein a direction of the first groove facing the central axis is the same as a direction of the second groove facing the central axis. 
     
     
         8 . The substrate processing apparatus of  claim 6 , wherein a direction of the first groove facing the central axis is different from a direction of the second groove facing the central axis. 
     
     
         9 . The substrate processing apparatus of  claim 1 , wherein the charging pad is positioned between the slurry supply unit and the polishing pad. 
     
     
         10 . The substrate processing apparatus of  claim 1 , wherein the polishing pad comprises polyurethane, and
 the charging pad comprises at least one of nylon, polypropylene, or a styrene-butadiene copolymer.   
     
     
         11 . A substrate processing apparatus comprising:
 a plate configured to support a polishing pad;   a polishing head on the polishing pad;   an external ring structure at least partially positioned outside of the polishing head; and   charging pads coupled to the external ring structure,   wherein the external ring structure includes:
 a driving unit supported by the polishing head; 
 an external ring surrounding the outside of the polishing head; and 
 a connection unit connecting the driving unit and the external ring, and 
   wherein the charging pads are circumferentially spaced apart from each other on a lower surface of the external ring.   
     
     
         12 . The substrate processing apparatus of  claim 11 , wherein the driving unit is configured to move the external ring in a vertical direction relative to an upper surface of the polishing pad. 
     
     
         13 . The substrate processing apparatus of  claim 11 , wherein the polishing head comprises a polishing head body and a retainer ring on a lower surface of the polishing head body, and
 the external ring surrounds an outer side surface of the retainer ring.   
     
     
         14 . The substrate processing apparatus of  claim 11 , wherein the charging pads are in contact with an upper surface of the polishing pad. 
     
     
         15 . A substrate processing apparatus comprising:
 a plate configured to rotate a polishing pad;   a polishing head on the polishing pad, and including a polishing head body and a retainer ring;   a slurry supply unit configured to supply slurry onto the polishing pad;   a conditioning unit spaced apart from the polishing head; and   a charging pad in contact with an upper surface of the polishing pad,   wherein the charging pad is spaced apart from the retainer ring, and   the charging pad includes at least one of nylon, polypropylene, or a styrene-butadiene copolymer.   
     
     
         16 . The substrate processing apparatus of  claim 15 , wherein the charging pad is between the slurry supply unit and the polishing head. 
     
     
         17 . The substrate processing apparatus of  claim 15 , wherein the charging pad is coupled to a side surface of the slurry supply unit. 
     
     
         18 . The substrate processing apparatus of  claim 15 , wherein the charging pad is adjacent an outer side surface of the retainer ring. 
     
     
         19 . The substrate processing apparatus of  claim 15 , wherein the charging pad has a shape of any one of a circle, a tetragon, and an arch. 
     
     
         20 . The substrate processing apparatus of  claim 15 , wherein friction charging is configured to occur between the charging pad and the polishing pad.