Substrate polishing apparatus

Abstract

A substrate polishing apparatus may be provided. The substrate polishing apparatus may include a platen, a polishing pad on the platen, a polishing head on the polishing pad, the polishing head including a polishing head body and a first magnetic structure on a side surface of the polishing head body, and a second magnetic structure adjacent to the first magnetic structure, wherein the second magnetic structure overlaps at least a portion of the first magnetic structure in a plan view.

What is claimed is: 
     
         1 . A substrate polishing apparatus comprising:
 a platen;   a polishing pad on the platen;   a polishing head on the polishing pad, the polishing head comprising a polishing head body and a first magnetic structure on a side surface of the polishing head body; and   a second magnetic structure adjacent to the first magnetic structure,   wherein the second magnetic structure overlaps at least a portion of the first magnetic structure in a plan view.   
     
     
         2 . The substrate polishing apparatus of  claim 1 , wherein the second magnetic structure is in the platen. 
     
     
         3 . The substrate polishing apparatus of  claim 2 , wherein the second magnetic structure includes an inner magnet and an outer magnet on an outer side of the inner magnet, and
 wherein at least a portion of the polishing head is positioned between the inner magnet and the outer magnet in a plan view.   
     
     
         4 . The substrate polishing apparatus of  claim 3 , wherein each of the inner magnet and the outer magnet has a ring shape around a rotation axis of the platen in a plan view. 
     
     
         5 . The substrate polishing apparatus of  claim 3 , wherein the inner magnet comprises a plurality of spaced apart inner magnets and the outer magnet comprises a plurality of spaced apart outer magnets. 
     
     
         6 . The substrate polishing apparatus of  claim 2 , wherein the second magnetic structure includes a plurality of straight magnets, and
 wherein the plurality of straight magnets is arranged radially about a rotation axis of the platen in a plan view.   
     
     
         7 . The substrate polishing apparatus of  claim 2 , wherein the second magnetic structure includes:
 an inner magnet having a ring shape;   an outer magnet on an outer side of the inner magnet; and   a plurality of straight magnets between the inner magnet and the outer magnet.   
     
     
         8 . The substrate polishing apparatus of  claim 7 , wherein the inner magnet, the outer magnet, and the plurality of straight magnets are spaced apart from each other. 
     
     
         9 . The substrate polishing apparatus of  claim 1 , further comprising a spindle structure on the polishing head,
 wherein the second magnetic structure is connected to both ends of the spindle structure.   
     
     
         10 . The substrate polishing apparatus of  claim 1 , wherein the first magnetic structure extends from a side surface of the polishing head body to an upper surface of the polishing head body. 
     
     
         11 . A substrate polishing apparatus comprising:
 a platen configured to rotate a polishing pad;   a polishing head on the polishing pad, the polishing head comprising a first magnetic structure;   a second magnetic structure in the platen; and   a power supply device electrically connected to the second magnetic structure,   wherein the first magnetic structure and the second magnetic structure are configured to form a magnetic force between the first magnetic structure and the second magnetic structure.   
     
     
         12 . The substrate polishing apparatus of  claim 11 , wherein the first magnetic structure includes a permanent magnet, and
 wherein the second magnetic structure includes an electromagnet.   
     
     
         13 . The substrate polishing apparatus of  claim 11 , wherein the second magnetic structure vertically overlaps at least a portion of the first magnetic structure. 
     
     
         14 . The substrate polishing apparatus of  claim 11 , wherein the polishing head includes a polishing head body and a retainer ring on a lower surface of the polishing head body, and
 wherein the first magnetic structure surrounds a side surface of the polishing head body.   
     
     
         15 . The substrate polishing apparatus of  claim 11 , wherein the second magnetic structure includes a plurality of straight magnets arranged radially about a rotation axis of the platen, and
 wherein the plurality of straight magnets is configured to be sequentially turned on/off.   
     
     
         16 . A substrate polishing apparatus comprising:
 a platen configured to support and rotate a polishing pad;   a polishing head on the polishing pad, the polishing head comprising a polishing head body and a first magnetic structure surrounding a side surface of the polishing head body;   a second magnetic structure in the platen;   a slurry supply device supplying slurry onto the polishing pad;   a conditioning device spaced apart from the polishing head on the platen; and   a power supply device electrically connected to the second magnetic structure,   wherein the second magnetic structure overlaps at least a portion of the first magnetic structure.   
     
     
         17 . The substrate polishing apparatus of  claim 16 , wherein the second magnetic structure includes an inner magnet and an outer magnet spaced apart from each other, and wherein each of the inner magnet and the outer magnet has a ring shape in a plan view. 
     
     
         18 . The substrate polishing apparatus of  claim 17 , wherein the first magnetic structure extends from a side surface of the polishing head body to an upper surface of the polishing head body, and
 wherein the inner magnet comprises a plurality of inner magnets and the outer magnet comprises a plurality of outer magnets.   
     
     
         19 . The substrate polishing apparatus of  claim 16 , wherein the second magnetic structure includes a plurality of straight magnets arranged radially about a rotation axis of the platen, and
 wherein some of the straight magnets overlap the first magnetic structure.   
     
     
         20 . The substrate polishing apparatus of  claim 16 , wherein a magnetic force is configured to be formed between the first magnetic structure and the second magnetic structure.