A Dual Bimorph Assembly

Abstract

A dual bimorph assembly includes a multilaminar element structure where each elements includes a perforated metal layer, a suffusing conductive ink layer and a transductive assembly. A retainer assembly is provided with conductive tabs and a retainer through connector electrically connects metal layers.

1 . A wire-free and adhesive free planar dual bimorph device comprising:
 a perforated outer top metal layer having a tip mass clamping hole disposed in a first end section and a second end section, and an off-center section including a retainer clamping hole and a terminal hole;   a first suffusing conductive ink layer that interlocks with the perforation of the outer top metal layer   a first transductive assembly including a transductive element having a tip mass spacer including a tip mass hole disposed at a first end and the having a tip mass spacer including a tip mass clamping hole disposed at a second end and an off-center section including a terminal hole and a retainer clamping hole, the transductive assembly being suffused to the first suffusing conductive ink layer;   a second suffusing conductive ink layer that suffused to the first transductive assembly;   a perforated central metal layer having a tip mass clamping hole disposed in a first end section and a second end section, and an off-center section including a terminal clamping hole and a retainer clamping hole, said the second suffusing conductive ink layer being interlocked with the perforations of the central metal layer;   a third suffusing conductive ink layer that interlocks with the perforation of the central metal layer;   a second transductive assembly including a transductive element having a tip mass spacer including a tip mass hole disposed at a first end and the having a tip mass spacer including a tip mass clamping hole disposed at a second end and an off-center section including a terminal hole and a retainer clamping hole, the transductive assembly being suffused to the third suffusing conductive ink layer;   a fourth suffusing conductive ink layer that suffused to the second transductive assembly; and   a perforated outer bottom metal layer having a tip mass clamping hole disposed in a first end section and a second end section, and an off-center section including a retainer clamping hole and a terminal hole, said the fourth suffusing conductive ink layer being interlocked with the perforations of the outer metal layer;   a retaining assembly having through holes aligned with the clamping retainer holes and the terminal clamping holes of the off-center section and that accepts a first and a second independent conductive tabs;   a retainer through connector that electrically connects the top outer metal layer and bottom outer metal layer and the first conductive tab located and a terminal through connector that electrically connects a second conductive tab and the central metal layer.   
     
     
         2 . The assembly of  claim 1  further comprising a first tip mass attached to the first tip mass clamping hole and a second tip mass attached to the second tip mass clamping hole. 
     
     
         3 . The assembly of  claim 1  wherein at least one of the first and second transductive assemblies is comprised of two separate transductive materials either side of the off-center section. 
     
     
         4 . The assembly of  claim 1  further comprising of multiple disposed cantilever beam assemblies of 1 that share common centroidal positive and negative thru-connectors.