Heating assembly, atomizer, and electronic atomization device

Abstract

A heating assembly, an atomizer, and an electronic atomization device are provided. The heating assembly includes a substrate and a heating film. The substrate includes a liquid absorbing surface and an atomizing surface that are oppositely disposed. The substrate is provided with a plurality of liquid guiding holes that go through the liquid absorbing surface and the atomizing surface. The heating film is disposed on the atomizing surface, the liquid guiding holes extend through the heating film. A density of the plurality of liquid guiding holes in a first direction is greater than a density of the plurality of liquid guiding holes in a second direction.

What is claimed is: 
     
         1 . A heating assembly, applied to an electronic atomization device to atomize an aerosol generating substance, the heating assembly comprising:
 a substrate including a liquid absorbing surface and an atomizing surface, wherein the substrate is provided with a plurality of liquid guiding holes that go through the liquid absorbing surface and the atomizing surface;   a heating film being disposed on the atomizing surface, wherein the plurality of liquid guiding holes extends through the heating film; and   a density of the plurality of liquid guiding holes in a first direction is greater than a density of the plurality of liquid guiding holes in a second direction.   
     
     
         2 . The heating assembly of  claim 1 , the heating film further comprising:
 a heating portion being strip-shaped and extending linearly in the first direction,   a first electrode and a second electrode, the first electrode and the second electrode being respectively disposed at two opposite ends of the heating portion in the first direction.   
     
     
         3 . The heating assembly of  claim 1 , wherein the plurality of liquid guiding holes is arranged in a plurality of rows in the first direction, and a plurality of columns in the second direction. 
     
     
         4 . The heating assembly of  claim 3 , wherein
 an aperture of the plurality of liquid guiding holes is greater than or equal to 20 μm and less than or equal to 50 μm;   a distance between hole centers of neighboring liquid guiding holes in each row of the plurality of rows is less than or equal to 100 μm; and/or   a distance between hole centers of neighboring liquid guiding holes in each column of the plurality of columns is greater than or equal to 40 μm and less than or equal to 100 μm.   
     
     
         5 . The heating assembly of  claim 3 , wherein at least two of the plurality of liquid guiding holes in each row of the plurality of rows are in communication with each other; and the plurality of liquid guiding holes in each column of the plurality of columns are spaced apart. 
     
     
         6 . The heating assembly of  claim 5 , wherein at least two of the plurality of liquid guiding holes in each row of the plurality of rows are overlap with each other on the atomizing surface. 
     
     
         7 . The heating assembly of  claim 5 , wherein the plurality of liquid guiding holes in each row of the plurality of rows are divided into a plurality of groups of liquid guiding holes; each group of the plurality of groups of liquid guiding holes comprises at least two liquid guiding holes, and all the liquid guiding holes in each group of liquid guiding holes are in communication with each other. 
     
     
         8 . The heating assembly of  claim 7 , wherein
 each group of the plurality of groups of liquid guiding holes comprises a same number of the liquid guiding holes; and/or   distances between hole centers of neighboring liquid guiding holes in each group of liquid guiding holes are the same.   
     
     
         9 . The heating assembly of  claim 7 , wherein
 an aperture of the plurality of liquid guiding holes is greater than or equal to 20 μm and less than or equal to 50 μm;   a distance between hole centers of neighboring liquid guiding holes in each row is less than or equal to 100 μm; and/or   a distance between hole centers of neighboring liquid guiding holes in each column is greater than or equal to 40 μm and less than or equal to 100 μm.   
     
     
         10 . The heating assembly of  claim 1 , wherein the substrate is a dense substrate or a porous substrate. 
     
     
         11 . The heating assembly of  claim 10 , wherein the substrate is the dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or
 the substrate is the porous substrate, and the material of the substrate is porous ceramic.   
     
     
         12 . The heating assembly of  claim 1 , wherein a thickness of the substrate is 0.2 mm to 2.5 mm. 
     
     
         13 . An atomizer, comprising:
 a liquid storage cavity being configured to store an aerosol generating substance; and   a heating assembly comprising,
 a substrate including a liquid absorbing surface and an atomizing surface, wherein the substrate is provided with a plurality of liquid guiding holes that go through the liquid absorbing surface and the atomizing surface, 
 a heating film being disposed on the atomizing surface, wherein the plurality of liquid guiding holes extends through the heating film, and 
 a density of the plurality of liquid guiding holes in a first direction is greater than a density of the plurality of liquid guiding holes in a second direction; and 
   wherein the heating assembly is in fluid communication with the liquid storage cavity, the heating assembly is configured to atomize the aerosol generating substance.   
     
     
         14 . The atomizer of  claim 13 , wherein electric energy is supplied for operation of the heating assembly of the atomizer to atomize the aerosol generating substance.