Electroless plating solution

Abstract

According to this invention, disclosed is an electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr and Al, dispersed in the parent phase.

What is claimed is: 
     
         1 . An electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr and Al, dispersed in the parent phase,
 the parent phase in the metal ion source having a composition represented by:   Cu: 5 to 0.02% by mass;   Cr: 0.001 to 18% by mass;   Al: 3 to 0.02% by mass; and   the balance of Sn,   the intermetallic compound crystal having a composition represented by:   Cu: 5 to 50% by mass;   Cr: 0.001 to 10% by mass;   Al: 0.1 to 20% by mass; and   the balance of Sn,   and a proportion of the intermetallic compound crystal being 20 to 60% by mass.   
     
     
         2 . An electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr, Al and Ni, dispersed in the parent phase,
 the parent phase in the metal ion source having a composition represented by:   Cu: 5 to 0.02% by mass;   Cr: 0.001 to 18% by mass;   Al: 3 to 0.02% by mass;   Ni: 1 to 0.02% by mass; and   the balance of Sn,   the intermetallic compound crystal having a composition represented by:   Cu: 5 to 50% by mass;   Cr: 0.001 to 18% by mass;   Al: 0.1 to 20% by mass;   Ni: 0.1 to 6.5% by mass; and   the balance of Sn,   and proportion of the intermetallic compound crystal being 20 to 60% by mass.