Ceramic spacers for electrochemical stack of ceramic oxygen purifier

Abstract

Systems for oxygen concentration and pressurization. An assembly includes a first ceramic wafer, a second ceramic wafer, and a ceramic spacer disposed in between the first ceramic wafer and the second ceramic wafer. The assembly is such that the ceramic spacer is attached to the first ceramic wafer with a first glass-ceramic seal, and the ceramic spacer is attached to the second ceramic wafer with a second glass-ceramic seal. The assembly is such that at least one of the first glass-ceramic seal or the second glass-ceramic seal is a gastight seal after undergoing two or more sintering cycles.

What is claimed is: 
     
         1 . An assembly comprising:
 a first ceramic wafer;   a second ceramic wafer; and   a ceramic spacer disposed in between the first ceramic wafer and the second ceramic wafer;   wherein the ceramic spacer is attached to the first ceramic wafer with a first glass-ceramic seal, and the ceramic spacer is attached to the second ceramic wafer with a second glass-ceramic seal; and   wherein at least one of the first glass-ceramic seal or the second glass-ceramic seal is a gastight seal after undergoing two or more sintering cycles.   
     
     
         2 . The assembly of  claim 1 , wherein the second ceramic wafer comprises an anode cap, and wherein the second glass-ceramic seal attaching the ceramic spacer to the second ceramic wafer is formed in between the ceramic spacer and the anode cap of the second ceramic wafer. 
     
     
         3 . The assembly of  claim 1 , wherein the ceramic spacer comprises:
 a first end, wherein the first end is attached to the first ceramic wafer;   a second end, wherein the second end is attached to the second ceramic wafer; and   an exposed portion, wherein the exposed portion is disposed in between the first ceramic wafer and the second ceramic wafer and defines a gap in between the first ceramic wafer and the second ceramic wafer.   
     
     
         4 . The assembly of  claim 1 , wherein the first ceramic wafer comprises: a first anode cap, a first anode, a first electrolyte, and a first cathode; and
 wherein the second ceramic wafer comprises: a second anode cap, a second anode, a second electrolyte, and a second cathode.   
     
     
         5 . The assembly of  claim 4 , wherein the first ceramic wafer comprises a first through-hole disposed therethrough, and wherein the first through-hole comprises:
 an electrolyte-anode portion comprising an electrolyte-anode radius, wherein the electrolyte-anode portion extends through each of the first anode cap, the first anode, and the first electrolyte; and   a cathode portion comprising a cathode radius, wherein the cathode portion extends through the first cathode;   wherein a length of the electrolyte-anode radius is smaller than a length of the cathode-radius.   
     
     
         6 . The assembly of  claim 5 , wherein the ceramic spacer comprises a sidewall defining a hollow cylindrical geometry that comprises an exterior radius and an interior radius; and
 wherein a length of the interior radius of the ceramic spacer is greater than or equal to the length of the electrolyte-anode radius of the first ceramic wafer.   
     
     
         7 . The assembly of  claim 5 , wherein the ceramic spacer comprises a sidewall defining a hollow cylindrical geometry that comprises an exterior radius and an interior radius; and
 wherein a length of the exterior radius of the ceramic spacer is less than or equal to the length of the cathode radius of the first ceramic wafer.   
     
     
         8 . The assembly of  claim 5 , wherein the ceramic spacer comprises a sidewall defining a hollow cylindrical geometry that comprises an exterior radius and an interior radius; and
 wherein a length of the interior radius of the ceramic spacer is greater than or equal to the length of the electrolyte-anode radius of the first ceramic wafer;   wherein a length of the exterior radius of the ceramic spacer is less than or equal to the length of the cathode radius of the first ceramic wafer; and   wherein the first through-hole of the first ceramic wafer and the interior of the hollow cylindrical geometry of the ceramic spacer form a continuous port for outputting purified oxygen gas.   
     
     
         9 . The assembly of  claim 1 , wherein the ceramic spacer comprises closed porosity. 
     
     
         10 . The assembly of  claim 1 , further comprising an interconnect disposed in between the first ceramic wafer and the second ceramic wafer, wherein the interconnect facilitates electrical communication between the first ceramic wafer and the second ceramic wafer. 
     
     
         11 . The assembly of  claim 1 , wherein the ceramic spacer is manufactured independently from the first ceramic wafer and the second ceramic wafer. 
     
     
         12 . The assembly of  claim 1 , wherein one or more of the first glass-ceramic seal or the second glass-ceramic seal is a fully devitrified seal. 
     
     
         13 . The assembly of  claim 1 , wherein one or more of the first glass-ceramic seal or the second glass-ceramic seal comprises lithium oxide, silicon dioxide, and aluminum oxide. 
     
     
         14 . The assembly of  claim 1 , wherein one or more of the first glass-ceramic seal or the second glass-ceramic seal comprises silicon oxide, calcium oxide, and magnesium oxide. 
     
     
         15 . The assembly of  claim 1 , wherein one or more of the first glass-ceramic seal or the second glass-ceramic seal comprises one or more of potassium oxide, boron oxide, phosphorus pentoxide, sodium oxide, or barium oxide. 
     
     
         16 . The assembly of  claim 1 , wherein one or more of the first glass-ceramic seal or the second glass-ceramic seal comprises a lithia-alumina-silica seal. 
     
     
         17 . The assembly of  claim 1 , wherein a thickness of one or more of the first glass-ceramic seal or the second glass-ceramic seal is customizable to compensate for a manufacturing tolerance introducing a non-flat portion in any of the first ceramic wafer, the second ceramic wafer, or the ceramic spacer. 
     
     
         18 . The assembly of  claim 1 , wherein the ceramic spacer is sealed to the first ceramic wafer and the second ceramic wafer in response to determining each of the first ceramic wafer and the second ceramic wafer is gastight. 
     
     
         19 . The assembly of  claim 1 , wherein each of the first ceramic wafer and the second ceramic wafer comprises a plurality of ceramic layers configured to transport oxygen ions and output purified oxygen gas.