Lightweight Combined Type Grinding Wheel
Abstract
The application relates to the technical field of grinding wheels. In order to overcome the defects of the grinding wheels in the art, e.g. the difficulty in chip removal and the short service life, the application provides a lightweight combined type grinding wheel, comprising a bottom plate, a cover plate and an adapter. The bottom plate and the cover plate are coaxially fitted and are fixed by the adapter. A plurality of bosses are formed on the surface of the bottom plate facing away from the cover plate. The plurality of bosses are evenly spaced around the axis of the bottom plate. Abrasive grains are laid on the top surface of each boss. The bosses are spaced from each other, and a chip groove is formed between two adjacent bosses. The chip groove is used to discharge the grinding chips generated by grinding. The application provides bosses and chip grooves on the cover plate, and lays diamond abrasive grains on the top surface of bosses by brazing, thereby improving the convenience of the grinding wheel in terms of chip storage and chip removal, and reducing the dust generated during grinding. In addition, when the abrasive grains are worn or fall off, the bottom plate can be replaced separately, so that the service life of the grinding wheel may be longer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A lightweight combined type grinding wheel, characterized in that the lightweight combined type grinding wheel comprises a bottom plate ( 1 ), a cover plate ( 2 ) and an adapter ( 3 ); wherein,
the bottom plate ( 1 ) and the cover plate ( 2 ) are coaxially fitted and detachably connected via the adapter ( 3 ); a plurality of bosses ( 6 ) are formed on a surface of the bottom plate ( 1 ) facing away from the cover plate ( 2 ); the plurality of bosses ( 6 ) are evenly spaced around the axis of the bottom plate ( 1 ); abrasive grains ( 7 ) are laid on the top surface of each of the bosses ( 6 ); the bosses ( 6 ) are spaced from each other, and a chip groove ( 4 ) is formed between two adjacent bosses ( 6 ); the chip groove ( 4 ) is used to discharge grinding chips generated by grinding.
2 . The lightweight combined type grinding wheel according to claim 1 , characterized in that a plurality of weight-reducing holes ( 8 ) are provided on both of the bottom plate ( 1 ) and the cover plate ( 2 ).
3 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the abrasive grains ( 7 ) are diamond abrasive grains; the diamond abrasive grains are fixed to the top surface of the bosses ( 6 ) by brazing.
4 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the top surface of the bosses ( 6 ) is elliptical.
5 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the top surface of the bosses ( 6 ) is arrow-shaped.
6 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the top surface of the bosses ( 6 ) is trapezoidal.
7 . The lightweight combined type grinding wheel according to claim 6 , characterized in that the number of the bosses ( 6 ) is six or eight.
8 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the centers of the bottom plate ( 1 ) and the cover plate ( 2 ) are both concaved along their common axis in a direction opposite to a protruding direction of the bosses ( 6 ) so as to form a mounting portion ( 5 ); and
the adapter ( 3 ) comprises a bolt ( 31 ) and a nut ( 32 ), which are fitted so as to lock the bottom plate ( 1 ) and the cover plate ( 2 ); the bolt ( 31 ) is used to connect the lightweight combined type grinding wheel to other devices.
9 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the thickness of the cover plate ( 2 ) is between 3 mm and 6 mm.
10 . The lightweight combined type grinding wheel according to claim 1 , characterized in that the thickness of the bottom plate ( 1 ) is between 0.8 mm and 1.5 mm.Join the waitlist — get patent alerts
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