Electroless ruthenium plating bath

Abstract

An electroless ruthenium plating bath contains at least a ruthenium compound, a reducing agent, and a stabilizer. The reducing agent is hydrazines. The stabilizer includes a hydroxylamine compound and an organic compound having a hydroxyl group. The hydroxylamine compound is either or both of hydroxylamine sulfate and hydroxylamine chloride. The organic compound having a hydroxyl group is at least one selected from the group consisting of gluconolactone, sorbitol, mannitol, and citric acid monohydrate.

1 . An electroless ruthenium plating bath comprising at least a ruthenium compound, a reducing agent, and a stabilizer, wherein
 the reducing agent is hydrazines,   the stabilizer includes a hydroxylamine compound and an organic compound having a hydroxyl group,   the hydroxylamine compound is either or both of hydroxylamine sulfate and hydroxylamine chloride, and   the organic compound having a hydroxyl group is at least one selected from the group consisting of gluconolactone, sorbitol, mannitol, and citric acid monohydrate.   
     
     
         2 . The electroless ruthenium plating bath of  claim 1 , wherein
 the ruthenium compound is at least one selected from the group consisting of ruthenium chloride, ruthenium sulfate, and ruthenium nitrate.   
     
     
         3 . The electroless ruthenium plating bath of  claim 1 , wherein
 a concentration of the hydroxylamine compound is 1 g/L or more and 10 g/L or less, and a concentration of the organic compound having a hydroxyl group is 1 g/L or more and 20 g/L or less.   
     
     
         4 . The electroless ruthenium plating bath of  claim 1 , wherein
 a concentration of the ruthenium compound is 0.01 g/L or more and 10 g/L or less, and a concentration of the reducing agent is 0.03 mol/L or more and 1.32 mol/L or less.   
     
     
         5 . The electroless ruthenium plating bath of  claim 1 , further comprising a deposition rate adjusting agent.