Graphics processing subsystems with dual blow-through architectures

Abstract

Example graphics processing subsystems and computing devices that include the graphics processing subsystem(s) are described. In one example, the graphics processing subsystem may comprise a first fan, a second fan and a printed circuit board (PCB) on which a processor is disposed. The first fan may be associated with a first axis about which the first fan is rotatable. The second fan may be associated with a second axis about which the second fan is rotatable. The PCB may be shaped and positioned such that (a) a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, and (b) a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan. The first airflow path and the second airflow path are substantially linear relative to the respective first axis and second axis.

1 . A graphics processing subsystem, comprising:
 a first fan that is associated with a first axis about which the first fan is rotatable;   a second fan that is associated with a second axis about which the second fan is rotatable; and   a printed circuit board (PCB) on which a processor is disposed, wherein the PCB is shaped and positioned such that:
 a first airflow path for cooling the processor traverses through the first fan and a first opening below the first fan, the first airflow path being substantially linear relative to the first axis; and 
 a second airflow path for cooling the processor traverses through the second fan and a second opening below the second fan, the second airflow path being substantially linear relative to the second axis. 
   
     
     
         2 . The graphics processing subsystem of  claim 1 , wherein the PCB is positioned at a distance from multiple input/output (I/O) ports of the graphics processing subsystem, the PCB being communicatively coupled to the multiple I/O ports via a connector. 
     
     
         3 . The graphics processing subsystem of  claim 2 , wherein the multiple I/O ports are positioned adjacent to the first fan, and the connector is configured to have an elongated shape that extends along the distance, outside of a boundary of the first fan. 
     
     
         4 . The graphics processing subsystem of  claim 1 , wherein the PCB is positioned between the first axis and the second axis in a middle section of the graphics processing subsystem such that the first airflow path traverses outside of a first edge of the PCB and the second airflow path traverses outside of a second edge of the PCB. 
     
     
         5 . The graphics processing subsystem of  claim 1 , wherein the PCB is positioned substantially below both the first fan and the second fan to create the first opening below the first fan and the second opening below the second fan. 
     
     
         6 . The graphics processing subsystem of  claim 1 , wherein the PCB is positioned substantially above both the first fan and the second fan. 
     
     
         7 . The graphics processing subsystem of  claim 1 , wherein the PCB is configured to have a generally rectangular or square shape such that the PCB partially overlaps with at least one of: the first fan along the first axis and the second fan along the second axis. 
     
     
         8 . The graphics processing subsystem of  claim 1 , wherein the PCB is shaped to include:
 a first curved-in edge such that there is substantially no overlap between the PCB and a first outer boundary of the first fan along the first axis; and   a second curved-in edge such that there is substantially no overlap between the PCB and a second outer boundary of the second fan along the second axis.   
     
     
         9 . The graphics processing subsystem of  claim 1 , wherein the PCB is shaped to include:
 a first cut-out such that the first airflow path traverses through the first cut-out before or after the first fan along the first axis; and   a second cut-out such that the second airflow path traverses through the second cut-out before or after the second fan along the second axis.   
     
     
         10 . The graphics processing subsystem of  claim 1 , further comprising a heat sink that is thermally coupled to the processor such that the first airflow path and the second airflow path traverse through the respective first opening and second opening in the heat sink. 
     
     
         11 . A computer system, comprising:
 a first processor;   a non-transitory computer-readable medium having stored thereon instructions that are executable by the processor; and   a graphics processing subsystem that includes a first fan, a second fan and a printed circuit board (PCB) on which a second processor is disposed, wherein the first fan is associated with a first axis about which the first fan is rotatable, the second fan is associated with a second axis about which the second fan is rotatable, and the PCB is shaped and positioned such that:
 a first airflow path for cooling the second processor traverses through the first fan and a first opening below the first fan, the first airflow path being substantially linear relative to the first axis; and 
 a second airflow path for cooling the second processor traverses through the second fan and a second opening below the second fan, the second airflow path being substantially linear relative to the second axis. 
   
     
     
         12 . The computer system of  claim 11 , wherein the PCB is positioned at a distance from multiple input/output (I/O) ports of the graphics processing subsystem, the PCB being communicatively coupled to the multiple I/O ports via a connector. 
     
     
         13 . The computer system of  claim 12 , wherein the multiple I/O ports are positioned adjacent to the first fan, and the connector is configured to have an elongated shape that extends along the distance, outside of a boundary of the first fan. 
     
     
         14 . The computer system of  claim 11 , wherein the PCB is positioned between the first axis and the second axis in a middle section of the graphics processing subsystem such that the first airflow path traverses outside of a first edge of the PCB and the second airflow path traverses outside of a second edge of the PCB. 
     
     
         15 . The computer system of  claim 11 , wherein the PCB is positioned substantially below both the first fan and the second fan to create the first opening below the first fan and the second opening below the second fan. 
     
     
         16 . The computer system of  claim 11 , wherein the PCB is positioned substantially above both the first fan and the second fan. 
     
     
         17 . The computer system of  claim 11 , wherein the PCB is configured to have a generally rectangular or square shape such that the PCB partially overlaps with at least one of: the first fan along the first axis and the second fan along the second axis. 
     
     
         18 . The computer system of  claim 11 , wherein the PCB is shaped to include:
 a first curved-in edge such that there is substantially no overlap between the PCB and a first outer boundary of the first fan along the first axis; and   a second curved-in edge such that there is substantially no overlap between the PCB and a second outer boundary of the second fan along the second axis.   
     
     
         19 . The computer system of  claim 11 , wherein the PCB is shaped to include:
 a first cut-out such that the first airflow path traverses through the first cut-out before or after the first fan along the first axis; and   a second cut-out such that the second airflow path traverses through the second cut-out before or after the second fan along the second axis.   
     
     
         20 . The computer system of  claim 11 , wherein the graphics processing subsystem further comprises a heat sink that is thermally coupled to the second processor such that the first airflow path and the second airflow path traverse through the respective first opening and second opening in the heat sink.