Liquid-cooling cooler having nickel multilayer structure

Abstract

A liquid-cooling cooler having a nickel multilayer structure includes a liquid-cooling cooler body and the nickel multilayer structure. The nickel multilayer structure is formed on the liquid-cooling cooler body for bonding with at least one heat source. A topmost layer of the nickel multilayer structure is a pure nickel electroplating layer, and a nickel content of the pure nickel electroplating layer is greater than 99 wt %. An electroless nickel-phosphorus plating layer is disposed beneath the pure nickel electroplating layer, and a phosphorus content of the electroless nickel-phosphorus plating layer ranges between 6 wt % and 13 wt %. The liquid-cooling cooler body is made of a non-nickel metal. A thickness of the pure nickel electroplating layer is less than or equal to 2 μm, and a thickness of the electroless nickel-phosphorus plating layer ranges between 3 μm and 12 μm.

What is claimed is: 
     
         1 . A liquid-cooling cooler, comprising:
 a liquid-cooling cooler body; and   a nickel multilayer structure;   wherein the nickel multilayer structure is formed on the liquid-cooling cooler body for bonding with at least one heat source; wherein a topmost layer of the nickel multilayer structure is a pure nickel electroplating layer, and a nickel content of the pure nickel electroplating layer is greater than 99 wt %; wherein an electroless nickel-phosphorus plating layer is disposed beneath the pure nickel electroplating layer, and a phosphorus content of the electroless nickel-phosphorus plating layer ranges between 6 wt % and 13 wt %; wherein the liquid-cooling cooler body is made of a non-nickel metal; wherein a thickness of the pure nickel electroplating layer is less than or equal to 2 μm, and a thickness of the electroless nickel-phosphorus plating layer ranges between 3 μm and 12 μm.   
     
     
         2 . The liquid-cooling cooler according to  claim 1 , wherein the liquid-cooling cooler body is made of a copper alloy, aluminum, or an aluminum alloy. 
     
     
         3 . The liquid-cooling cooler according to  claim 1 , wherein a pure nickel flash plating layer is further formed between the liquid-cooling cooler body and the electroless nickel-phosphorus plating layer, and a nickel content of the pure nickel flash plating layer is greater than 99 wt %. 
     
     
         4 . The liquid-cooling cooler according to  claim 1 , wherein an anti-oxidation sealing layer is further formed on the pure nickel electroplating layer that is the topmost layer of the nickel multilayer structure. 
     
     
         5 . The liquid-cooling cooler according to  claim 1 , wherein the pure nickel electroplating layer and the electroless nickel-phosphorus plating layer of the nickel multilayer structure are each a matte nickel layer without addition of a brightening agent. 
     
     
         6 . The liquid-cooling cooler according to  claim 1 , wherein gold, tin, silver, or alloying elements thereof are absent between the liquid-cooling cooler body and the nickel multilayer structure, and are absent in and above the nickel multilayer structure.