Process and apparatus for producing thin copper foils on a molybdenum or tzm alloy drum

Abstract

A process and apparatus for producing thin copper foils by electroplating the copper onto a rotating drum serving as a cathode where the surface of the rotating drum is molybdenum or TZM alloy.

1.  In a process for preparing thin copper foils, the improvement comprising, electrodepositing the copper on a rotating electrode having a molybdenum surface.   
     
     
       2. In a process for preparing thin copper foils, the improvement comprising electrodepositing the copper on a rotating electrode having a surface formed from a titanium, zirconium, molybdenum alloy. 
     
     
       3. A process in accordance with claim 1 wherein the copper is plated from a soluble anode in a plating solution of proportions 240 grams CuSO 4 .5H 2  O, 60 grams H 2  SO 4  and 1 liter of H 2  O. 
     
     
       4. A process in accordance with claim 1 wherein the copper is plated from a soluble anode in a plating solution consisting of cupric fluorobate, fluoboric acid and boric acid in distilled water. 
     
     
       5. A process in accordance with claim 4 wherein the plating solution proportions are: 2.05 M cupric fluoborate, 0.44 M fluoborate acid and 1.05 M boric acid in distilled water. 
     
     
       6. Apparatus for the electrolytic production of copper foil comprising, an electrolyte tank,   a copper anode having at least a portion of its surface within said electrolyte tank,   a rotatable drum having a portion of its surface disposed within said tank, said rotatable drum having a molybdenum surface and means to rotate said drum.   
     
     
       7. Apparatus in accordance with claim 6 wherein said rotatable drum has a surface formed of titanium, zirconium, molybdenum alloy.