Dressing and conditioning resin-bonded diamond grinding wheel

Abstract

A method comprising contacting a wetting liquid with the surface of a resin-bonded diamond grinding wheel, wetting and forming a film on the face of the resin component of the wheel surface, and grinding and resulting wetted wheel surface with a silicon carbide or silicon nitride ceramic body generating ceramic chips which adhere to said wetted resin face forming a slurry layer thereon which simultaneously dresses and conditions said wheel during grinding.

We claim: 
     
       1. A method for simultaneously dressing and conditioning a resin-bonded diamond grinding wheel during grinding which comprises contacting the surface of said resin-bonded diamond grinding wheel with a wetting liquid which wets the face of the resin component of said wheel surface forming a film thereon, grinding the wetted wheel with a polycrystalline ceramic body selected from the group consisting of silicon carbide which ranges in density from about 80% to about 100% of the density of silicon carbide and silicon nitride which ranges in density from about 80% to about 100% of the density of silicon nitride generating chips of said ceramic body which adhere to said wetted resin face forming a slurry layer thereon and grinding the resulting wheel with a workpiece. 
     
     
       2. A method according to claim 1 wherein said polycrystalline body is silicon carbide. 
     
     
       3. A method according to claim 1 wherein said polycrystalline body is silicon nitride. 
     
     
       4. A method according to claim 1 wherein said wetting liquid is composed of water and lubricating agent.