US4241493AExpiredUtility

Method of fabricating solar cell modules

Individually held — no corporate assignee on recordPriority: Dec 22, 1978Filed: Dec 22, 1978Granted: Dec 30, 1980
Est. expiryDec 22, 1998(expired)· nominal 20-yr term from priority
H10F 19/80B32B 2367/00Y10T29/49146Y02E10/50B32B 17/10119B32B 27/20B32B 17/10018
85
PatentIndex Score
72
Cited by
9
References
6
Claims

Abstract

The solar cell module of this invention is fabricated by placing an array of solar cells in a suitable mold having a bottom surface, an entry port and an exit port. A light transparent superstrate effectively serves as the top for the mold and is placed over the array of solar cells in the mold. The superstrate is spaced from the array such that the superstrate does not come in contact with the top surface of any of the cells or interconnectors of the solar cell array. Clamp means are provided to hold the superstrate in position while encapsulant is pumped into the mold under pressure through the inlet port in an amount sufficient to fill the mold. Thereafter the assembly can be placed in an oven and heated for a time sufficient to cure the encapsulant and bond the materials to each other.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method of fabricating a solar cell module having a rigid, light transparent superstrate and a plurality of solar cells arrayed on the bottom surface of such superstrate which comprises: preparing an array of solar cells electrically interconnected one to the other in serial and/or parallel fashion;   placing said array of solar cells in a mold, said mold having an inlet port and an outlet port and a depth substantially equal to the thickness of the module being formed;   substantially limiting the movement of said array placed in said mold;   placing and securing a rigid light transparent electrically nonconductive superstrate on top of said mold, said superstrate being spaced from the top of the array, whereby a cavity is defined between said rigid transparent member and the bottom of said mold;   pumping an encapsulant through the inlet port of said mold until all the air is expelled from the cavity defined by said superstrate and the bottom of mold; and   thereafter curing said encapsulant, thus bonding said superstrate to said array; then removing the module, including said superstrate, from the mold.   
     
     
       2. The method of claim 1 wherein the movement of said array is substantially limited by first lining said mold with a backing sheet for said module and adhesively bonding said array to said backing sheet. 
     
     
       3. The method of claim 2 wherein said backing sheet is a film of an optically white sheet material and said array is bonded to said backing sheet by applying an adhesive to the top surface of said white sheet material at least at locations corresponding to the location of the solar cells in said array; placing said array on top of said resin adhesive; and thereafter applying sufficient pressure so as to cause the adhesive to flow completely over the surface of the bottom of each of the plurality of solar cells in said array. 
     
     
       4. The method of claim 1 wherein the movement of said array is substantially limited by first lining said mold with a backing sheet having raised land areas at locations between each cell in the array whereby said raised land areas limit the movement of said array in said mold. 
     
     
       5. A method of fabricating a solar cell module having a rigid light transparent superstrate and a plurality of solar cells arrayed on the bottom surface of said superstrate comprising: preparing an array of solar cells electrically interconnected one to the other in serial and/or parallel fashion;   placing said array of solar cells in a mold, said mold having an inlet port and an outlet port and a depth substantially equal to the thickness of the module being formed;   placing an optically white backing sheet in said mold;   placing an adhesive at least at each location corresponding to the location of the solar cells in the array in an amount sufficient to form a thin film of adhesive on the back of each of said cells of the array and to bond the cells to the backing sheet whereby the movement of cells in the mold is substantially limited;   placing said array on said adhesive;   applying pressure to said array in an amount and for a time sufficient to bond said array to said backing sheet;   placing and securing a rigid light transparent electrically nonconductive superstrate on top of said mold, said superstrate being spaced from the top of the array, whereby a cavity is defined between said rigid transparent member and the bottom of said mold;   pumping an encapsulant through the inlet port of said mold until all the air is expelled from the cavity defined by said superstrate and the bottom of mold; and   thereafter curing said encapsulant, thus bonding said superstrate to said array; then removing the module, including said superstrate, from the mold.   
     
     
       6. A method of fabricating a solar cell module having a rigid light transparent superstrate and a plurality of solar cells arrayed on the bottom surface of said superstrate comprising: preparing an array of solar cells electrically interconnected one to the other in serial and/or parallel fashion;   placing said array of solar cells in a mold, said mold having an inlet port and an outlet port and a depth substantially equal to the thickness of the module being formed;   placing an optically white backing sheet in said mold, said backing sheet having raised land areas at locations between each cell in the array whereby said land areas limit the movement of said array in said mold;   placing said array in said mold on said backing sheet so that the raised land areas thereof are located between the cells of the array;   placing and securing a rigid light transparent electrically nonconductive superstrate on top of said mold, said superstrate being spaced from the top of the array, whereby a cavity is defined between said rigid transparent member and the bottom of said mold;   pumping an encapsulant through the inlet port of said mold until all the air is expelled from the cavity defined by said superstrate and the bottom of mold; and   thereafter curing said encapsulant, thus bonding said superstrate to said array; then removing the module, including said superstrate, from the mold.

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