Method of soldering a first vitreous component to a second component

Abstract

A method of soldering a first, vitreous component for example a sheet to at least one second component which is vitreous or metallic, in which the or each vitreous component is metallized in the joint region(s), the components are assembled together in the required relationship where they may be held by a clamp and the joint region(s) of the assembly is or are dipped in a bath of molten solder to bond it together as a unit. Such a unit may be constituted as an envelope containing one or more electrical circuit components, as a fluid flow directing unit or as a pane for incorporation into a leaded window.

We claim: 
     
       1. A method of manufacturing a panel unit comprising the steps of assembling a first, vitreous sheet, and at least one other sheet held in spaced relation by at least one elongated metallic spacer intervening between metallic or metallised portions of each successive pair of sheets thereby forming an elongated joint region between each sheet and said spacer, said spacer comprising a web having a width greater than its thickness, said width of the spacer web governing the extent of sheet separation, and then dipping the elongated joint regions of the thus obtained assembly in a bath of molten solder. 
     
     
       2. A method according to claim 1, wherein said spacer contacts said sheets at elongate joint regions extending along substantially the full length of at least one side edge margin of the sheets, and wherein said regions are dip-soldered as a whole. 
     
     
       3. A method according to claim 1 or 2, wherein said joints regions extend around substantially the whole margin of the sheets. 
     
     
       4. A method according to claim 1, wherein said panel unit is a hollow panel unit. 
     
     
       5. A method as in claim 1 wherein said bath of solder is maintained at a temperature between 20° C. and 100° C. above the liquidus temperature of the solder used in the bath. 
     
     
       6. A method as in claim 1 wherein the solder in said bath is a lead/tin alloy. 
     
     
       7. A method as in claim 6 wherein said solder contains by weight, between 60% and 35% lead. 
     
     
       8. A method as in claim 6 or 7 wherein said solder contains at least 15% tin and at most 40% bismuth by weight. 
     
     
       9. A method as in claim 1 including applying flux to said joint regions prior to dipping. 
     
     
       10. A method as in claim 1 wherein at least one of said sheets is surface-coated with solder at least over its respective joint region prior to dipping. 
     
     
       11. A method as in claim 10 wherein said solder coating is effected using a solder alloy of the same composition as the solder of said bath. 
     
     
       12. A method as in claim 1 wherein said spacer is formed from a flat metal strip. 
     
     
       13. A method as in claim 1 wherein said spacer has at least one flange portion for soldering in face-to-face relation with one of said sheets. 
     
     
       14. A method as in claim 1 wherein said spacer is formed of an Invar alloy. 
     
     
       15. A method as in claim 1 wherein said spacer is formed of a Kovar alloy. 
     
     
       16. A method as in claim 1 including heating said vitreous sheet prior to dipping in said bath of molten solder. 
     
     
       17. A method as in claim 1 including giving said spacer a metallic coating of a composition different from the spacer. 
     
     
       18. A method as in claim 17 said coating is tin. 
     
     
       19. A method as in claim 1 including assembling at least one electrical component between said sheets. 
     
     
       20. A method as in claim 19 wherein said electrical component is a solar energy transducer. 
     
     
       21. A method as in claim 1 wherein said other sheet is a metal sheet. 
     
     
       22. A method as in claim 1 wherein said other sheet is a vitreous sheet, each of said sheets being metallised in the respective joint region.