Method of making ceramic lid assembly for hermetic sealing of a semiconductor chip

Abstract

A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a preflowed solderable layer in registration with each other in the hermetic sealing area.

What is claimed is: 
     
       1. A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing a metallized layer on the surface of said lid at the periphery thereof, depositing a printed heat fusible solderable layer over said metallized layer at the periphery of said lid, and preflowing said integral heat fusible solderable layer thereto. 
     
     
       2. A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing a metallized layer on the surface of said lid at the periphery thereof, depositing a heat fusible preform of a solderable alloy over said metallized layer at the periphery of said lid and preflowing said heat fusible preform. 
     
     
       3. The method as set forth in claim 2 further including placing a forging weight on top of said lid to enhance the wetting of said metallized layer by said heat fusible preform when said preform begins to melt. 
     
     
       4. The method as set forth in claim 2 further including depositing an oxidation inhibiting layer between said metallized layer and said heat fusible preform.