Organopolysiloxane coating compositions

Abstract

Fast-curing resin compositions for coating metal surfaces are described. They comprise a high molecular weight epoxy resin, an etherified resol phenolic resin, a silicone fluid and an organopolysiloxane release resin, with an zinc-iron organometallic curing agent and a solvent. In addition to curing rapidly (one minute or less), the resin compositions are flexible and metal sheets coated therewith can be pressed or bent into various shapes and forms without the resin coating cracking or chipping.

We claim: 
     
       1. A fast-curing resin coating composition comprising: (i) 10-25 parts of an epoxy resin of molecular weight 50,000 to 200,000,   (ii) 1-3 parts of an etherified resol phenolic resin,   (iii) 1-3 parts of a silicone fluid comprised of methylphenylsiloxanes, dimethylsiloxanes and diphenyldemethylsiloxanes,   (iv) 12-20 parts of an organopolysiloxane release resin prepared by (a) agitating a mixture comprising (A) an organohalosilane blend consisting essentially of about 60 mole percent methyltrichlorosilane, about 35 mole percent phenyltrichlorosilane, and about 5 mole percent dimethyldichlorosilane, (B) water, (C) acetone, and (D) a water-immiscible organic solvent, wherein there is present by weight in said mixture per part by weight of (A), about 1.7 to about 10 parts of (B), about 0.2 to about 5 parts of (C), and about 0.3 to about 5 parts of (D); and   (b) separating the organic solvent solution of (F) from the resulting hydrolysis mixture of a step (i), wherein (F) is a silanol-containing organopolysiloxane resin having an average ratio of about 1.05 organic radicals per silicon atom,   (vi) a catalytic amount of an zinc-iron organometallic curing agent, in a   (vii) suitable solvent, all of the parts being parts by weight.     
     
     
       2. A resin composition according to claim 1 wherein the high molecular epoxy resin is a bisphenol A-epichlorohydrin resin. 
     
     
       3. A resin composition according to claim 2 wherein the etherified resol phenolic resin is a bisphenol-formaldehyde resin. 
     
     
       4. A resin composition according to claim 3 wherein the silanol-containing organopolysiloxane release resin is produced from phenyltrichlorosilane. 
     
     
       5. A resin composition according to claim 4 wherein the organopolysiloxane release resin is produced from a silane blend of methyltrichlorosilane, phenyltrichlorosilane and dimethyldichlorosilane. 
     
     
       6. A resin composition according to claim 5 wherein the silanol-containing organopolysiloxane release resin is produced from a silane blend of 526 parts of methyltrichlorosilane, 436 parts of phenyltrichlorosilane and 38 parts of dimethyldichlorosilane.