Multiple connection bond pad for an integrated circuit device and method of making same

Abstract

A bond region is provided on an integrated circuit chip wherein the bond region has two or more sets of closely spaced conductors, each of which is electrically connected to a different point of the integrated circuit. During the manufacturing of the device, at the time of assembly of the chip into the package one end of a connector wire may, optionally, be bonded to the bond region thereby effecting a multiple connection of these different points of the integrated circuit. Such a procedure will enable a specific mode of operation of a multi-mode device.

We claim: 
     
       1. An integrated circuit device having formed thereon: (a) an integrated circuit selectively capable of operating in any of a plurality of modes of operation;   (b) a plurality of conductor paths arranged within and electrically connected to said integrated circuit so that when said conductor paths are electrically separate said integrated circuit is operable in one of said plurality of modes of operation and when two or more of said plurality of conductor paths are electrically connected said integrated circuit is operable in another of said plurality of modes of operation; and   (c) a bond region means for effecting an electrical connection between at least two of said plurality of conductor paths only when a portion of a conducting material is bonded to said bond region means.   
     
     
       2. The device set forth in claim 1 including a plurality of circuit components formed integral to said integrated circuit and a plurality of bond pads formed thereon, wherein said plurality of conductor paths each have a first end that is connected to one of said plurality of circuit components and a second end that is connected to a different one of said plurality of bond pads. 
     
     
       3. The device as set forth in claim 2 wherein said bond region means comprises a plurality of closely spaced conductors each of which has a free end and a connected end, wherein each of said connected ends is connected to a different one of said plurality of bond pads and each of said conductors is disposed adjacent to and spaced apart from another of said conductors. 
     
     
       4. The device as set forth in claim 2 wherein said bond region means comprises a first set of closely spaced conductors electrically connected to one of said plurality of bond pads and a second set of closely spaced conductors electrically connected to another of said plurality of bond pads, wherein said first and second sets of closely spaced conductors are mutually interlayed for a substantial portion of their respective lengths so that each conductor of said first set is adjacent to and spaced apart from a conductor of said second set whereby said first and second sets of conductors are electrically separate. 
     
     
       5. The device as set forth in claim 4 wherein said conducting material is a connector wire. 
     
     
       6. The device as set forth in claim 5 wherein said conductors of said first and second sets of conductors are arranged substantially coplanar and mutually substantially parallel. 
     
     
       7. An integrated circuit device having a plurality of curcuit components formed thereon including a plurality of bond pads electrically connected to said circuit components and a bond region means for effecting an electrical interconnection between at least two of said plurality of bond pads only when a portion of a connector wire is bonded to said bond region means. 
     
     
       8. The device as set forth in claim 7 wherein said bond region means comprises a plurality of closely spaced conductors each of which has a free end and a connected end, wherein each of said connected ends is connected to a different one of said plurality of bond pads and each of said conductors is disposed adjacent to and spaced apart from another of said conductors. 
     
     
       9. The device as set forth in claim 7 wherein said bond region means comprises a first set of closely spaced conductors electrically connected to one of said plurality of bond pads and a second set of closely spaced conductors electrically connected to another of said plurality of bond pads, wherein said first and second sets of closely spaced conductors are mutually interlayed for a substantial portion of their respective lengths so that each conductor of said first set is adjacent to and spaced apart from a conductor of said second set whereby said first and second sets of conductors are electrically separate. 
     
     
       10. The device as set forth in claim 9 including a connector wire having one portion thereof bonded to said at least one bond region means whereby said first and second sets of conductors are electrically connected to said one portion of said wire. 
     
     
       11. The device as set forth in claim 10 wherein said conductors of said first and second sets of conductors are arranged substantially coplanar and mutually substantially parallel. 
     
     
       12. In a method of making an integrated circuit device having a plurality of circuit components formed thereon including a plurality of bond pads electrically connected to said circuit components, the steps comprising: (a) forming a bond region having at least two electrically independent conductive portions being mutually adjacent and closely spaced; and   (b) electrically connecting each of said at least two conductive portions to a different one of said plurality of bond pads.   
     
     
       13. The method as set forth in claim 12 including the steps of: forming said at least two electrically independent conductive portions each with a set of closely spaced conductors electrically connected to their respective conductive portions and mutually interlayed for a portion of their respective lengths.   
     
     
       14. The method as set forth in claim 13 including the setps of: bonding one end of a connector wire to said bond region so that said at least two electrically independent conductive portions are electrically connected to said one end of said connector wire.