US4598472AExpiredUtility

Method for forming a hemispherically shaped switch assembly

22
Assignee: AMP INCPriority: Aug 19, 1983Filed: Aug 19, 1983Granted: Jul 8, 1986
Est. expiryAug 19, 2003(expired)· nominal 20-yr term from priority
Y10T29/49155B29L 2031/3443Y10T29/49158H01H 13/703H01H 2209/082H01H 2209/06H01H 2223/026H01H 2209/038H01H 13/702H01H 2229/042H01H 2231/004B29C 51/14
22
PatentIndex Score
1
Cited by
16
References
4
Claims

Abstract

A hemispherically shaped membrane switch assembly for attaching to generally hemispherical surfaces such as cathode ray tubes is disclosed. Also disclosed are a method and apparatus for forming the assembly. The assembly is comprised of two layers of transparent film having spaced-apart conductors on the internal surfaces of both layers. The internal surfaces are separated by spacing means, the spacing means being discontinuous at the switch sites. The conductors on the two layers cross and are spaced apart at the switch sites. The assembly is hemispherically formed to the same radius as the hemispherical surface on which the assembly is to be mounted. The assembly mounts flush to the hemispherical surface and conforms uniformly to its surface thus reducing distortion and parallax.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method for forming flexible film for attaching to generally hemispherical surfaces, the film being of the type used in membrane switches, one side of the film having electrical conductors thereon, the method being characterized by the steps of: applying conductors to one surface of a flat flexible film, to form a circuit layer,   placing the flexible film circuit layer between two parallel retaining layers of thermoplastic film, the periphery of the circuit layer being freely held between the two retaining layers,   clamping the retaining layers of film between concave and convex surfaces,   transferring heat to at least one surface of the retaining layers until the circuit layer attains a hemispherical shape,   applying a vacuum to the concave surface to hold the circuit layer in its formed condition as the heat is removed and the flexible film circuit layer is allowed to cool.   
     
     
       2. The method for forming flexible film for attaching to generally hemispherical surfaces as recited in claim 1, wherein the conductors are narrow electrodeposited conductors. 
     
     
       3. The method for forming flexible film for attaching to generally hemispherical surfaces as recited in claim 1 wherein the conductors are narrow screened ink conductors. 
     
     
       4. The method for forming flexible film for attaching to generally hemispherical surfaces as recited in claim 1, wherein a sheet of freely held flexible mesh is placed between the circuit layer and the lower retaining layer.

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