US4814396AExpiredUtility

Blends of polycarbonate resins and polyetherimide ester resins

54
Assignee: GEN ELECTRICPriority: Dec 31, 1987Filed: Dec 31, 1987Granted: Mar 21, 1989
Est. expiryDec 31, 2007(expired)· nominal 20-yr term from priority
Inventors:Nan-I Liu
C08L 79/08C08L 69/00
54
PatentIndex Score
11
Cited by
4
References
24
Claims

Abstract

Novel thermoplastic elastomeric molding compositions having excellent physical properties, which comprise a blend of a polyetherimide ester elastomer and a polycarbonate resin.

Claims

exact text as granted — not AI-modified
I claim: 
     
       1. A thermoplastic molding composition comprising a blend of: (A) At least one polyetherimide ester resin, and   (B) At least one polycarbonate resin; wherein the polyetherimide ester resin comprises from about 10 to about 90 percent by weight of the total composition of (A) and (B) and the polycarbonate resin comprises from about 90 to about 10 percent by weight of the total composition of (A) and (B).     
     
     
       2. The composition of claim 1 wherein the polycarbonate resin is an aromatic polycarbonate resin derived from a diphenol and phosgene or a phosgene precursor. 
     
     
       3. The composition of claim 2 wherein the aromatic polycarbonate resin is poly(bisphenol A)carbonate. 
     
     
       4. The composition of claim 1 wherein said polyetherimide ester resin is comprised of the reaction products of: (a) at least one diol;   (b) at least one dicarboxylic acid or an ester forming reactive derivative thereof; and   (c) a set of reactants selected from   (1) (i) at least one high molecular weight poly(oxy alkylene)diamine, and (ii) at least one tricarboxylic acid or a derivative thereof, or (2) at least one high molecular weight polyoxyalkylene diimide diacid.     
     
     
       5. The composition of claim 4 wherein said diol is a low molecular weight diol. 
     
     
       6. The composition of claim 4 wherein said diol is selected from butanediol, butenediol, hexanediol, cyclohexane dimethanol, or mixtures thereof. 
     
     
       7. The composition of claim 4 wherein said dicarboxylic acid or its derivative is an aromatic dicarboxylic acid or its derivative. 
     
     
       8. The composition of claim 4 wherein (c) is (1). 
     
     
       9. The composition of claim 8 wherein said high molecular weight poly(oxy alkylene)diamine is represented by the formula   H.sub.2 N--G--NH.sub.2     wherein G is the radical remaining after the removal of the amino groups of a long chain alkylene ether diamine.   
     
     
       10. The composition of claim 9 wherein said poly(oxy alkylene)diamine has an average molecular weight of from about 600 to about 12,000. 
     
     
       11. The composition of claim 10 wherein said poly(oxy alkylene)diamine is selected from poly(ethylene ether)diamine, poly(propylene ether)diamine, poly(tetramethylene ether)diamine, copoly(propylene etherethylene ether)diamine, or mixtures thereof. 
     
     
       12. The composition of claim 8 wherein said tricarboxylic acid or its derivative is represented by the formula ##STR7## wherein R is a C 1  to C 20  trivalent aliphatic, cycloaliphatic or aromatic radical, and R" is hydrogen or a C 1  -C 6  aliphatic monovalent radical. 
     
     
       13. The composition of claim 4 wherein (c) is (2). 
     
     
       14. The composition of claim 13 wherein said high molecular weight polyoxyalkylene diimide diacid is represented by the formula ##STR8## wherein: each R is independently selected from C 1  -C 20  aliphatic, cycloaliphatic or aromatic trivalent organic radicals; each R" is independently selected from hydrogen, C 1  -C 6  aliphatic or cycloaliphatic organic radicals, or C 6  -C 12  aromatic monovalent organic radicals; and   G is the radical remaining after the removal of the amino groups of a long chain alkylene ether diamine.   
     
     
       15. The composition of claim 14 wherein said long chain alkylene ether diamine has an average molecular weight of from about 600 to about 12,000. 
     
     
       16. The composition of claim 1 wherein said polyetherimide ester resin is comprised of at least the following recurring structural units: ##STR9## wherein: R 1  is the residue of a diol absent the two hydroxyl groups; R 2  is the residue of a dicarboxylic acid absent the two carboxyl groups;   R is a trivalent organic radical; and   G is the radical remaining after the removal of the amino groups of a long chain poly(oxy alkylene)diamine.   
     
     
       17. The composition of claim 16 wherein said poly(oxy alkylene)diamine has an average molecular weight of from about 600 to about 12,000. 
     
     
       18. The composition of claim 16 wherein R 2  is the residue of an aromatic dicarboxylic acid. 
     
     
       19. The composition of claim 18 wherein R 2  is the residue of dimethylterephthalate. 
     
     
       20. The composition of claim 18 wherein R 1  is the residue of a diol having a molecular weight of about 250 or less. 
     
     
       21. The composition of claim 20 wherein said diol is selected from butanediol, butenediol, hexanediol, cyclohexane dimethanol or mixtures thereof. 
     
     
       22. The composition of claim 21 wherein said diol is butanediol. 
     
     
       23. The composition of claim 1 which further contains an effective stabilizing amount of at least one thermal stabilizer. 
     
     
       24. The composition of claim 1 which further contains a filler.

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