Tape automated bonding package

Abstract

The disclosure describes a new and improved Tape Automated Bonding package which admits of certain advantages that are not available with the packages as used in the past, and it overcomes some limitations with the previous packages which permits a significant step forward in realizing these advantages. Briefly, the disclosure describes a division of the dielectric support used to package integrated circuit chips in order to separate the power conductors and the signal conductors into different parts of the support. The conductors formed on at least one of these parts, preferably the part used to connect input/output signals to and from a chip, are arranged in radially extending rows to achieve more than twice the number of such connections.

What is claimed is: 
     
       1. A Tape Automated Bonding package to obtain a substantial increase in number of input/output connections for packaging an integrated circuit chip, and to obtain a separation of power distribution from such input/output connections used for signals, comprising: first dielectric means supporting lands of electrically conductive material in a predetermined pattern with terminals for bonding to said integrated circuit chip, and defining openings therein;   second dielectric means supporting a pattern of electrically conductive leads with ends for bonding to pads on said integrated circuit chip, and defining openings over which said ends extend;   power distribution panel means, separate from said first and second dielectric means, for supplying power to said integrated circuit chip through lands of electrically conductive material supported by said first dielectric means; and   a multilayer printed circuit panel for providing support for said second dielectric means;   so that a package will comprise said multilayer printed circuit panel, said second dielectric means, said first dielectric means, said integrated circuit chip, and said power distribution panel means.   
     
     
       2. A Tape Automated Bonding package according to claim 1 wherein said power distribution panel means is formed of multilayers with lands of electrically conductive material separated by electrically non-conductive material, and means for connecting predetermined lands on said power distribution panel means to predetermined lands supported by said first dielectric means. 
     
     
       3. A Tape Automated Bonding package according to claim 1 including two multilayer printed circuit panels, one of said multilayer printed circuit panels being located for providing support for said second dielectric means; and the other of said two multilayer printed circuit panels being formed by said power distribution panel means, so that said integrated circuit chip is located between said two multilayer printed circuit panels to provide separation between power distribution means and input/output signal means. 
     
     
       4. A Tape Automated Bonding package according to claim 1 including means to form electrical connections between predetermined lands on said power distribution means and predetermined lands supported by said first dielectric means. 
     
     
       5. A Tape Automated Bonding package according to claim 4 wherein said means to form electrical connections includes readily detachable connection means. 
     
     
       6. A Tape Automated Bonding package according to claim 5 wherein said detachable connection means includes pin and spring receptacle means. 
     
     
       7. A Tape Automated Bonding package according to claim 5 wherein said detachable connection means includes spring contact means attached to a land supported by said first dielectric means located to form an electrical contact with terminal means attached to a land on said power distribution panel means. 
     
     
       8. A Tape Automated Bonding package according to claim 1 wherein said openings defined by said first dielectric means are located relative to said openings defined by said second dielectric means so that access to said lead ends extending there over is available for bonding to corresponding pads on said integrated circuit chip. 
     
     
       9. A Tape Automated Bonding package according to claim 1 wherein said lands of electrically conductive material supported by said first dielectric means includes parts extending over the edge of said dielectric material and bent in the direction of said power distribution panel for bonding to predetermined lands on said power distribution panel so that said lands supported by said first dielectric means perform as power connections between said power distribution panel means and said integrated circuit chip.