Process for preparing heat and light stabilized Nylon 66 polymer

Abstract

Nylon 66 polymer is stabilized against heat and light during its preparation by conducting the polymerization in the presence of certain copper complexes, such as cupric amminohydroxide, and KBr and/or KI. Less metallic copper is formed during polymerization than if copper salts (e.g. copper acetate) are used instead of the copper complexes.

What we claim is: 
     
       1. A process for incorporating copper ions into poly-(hexamethylene adipamide) polymer comprising: (a) forming an aqueous solution comprising KI and/or KBr, diammonium adipate salt and a copper complex selected from the group consisting of cupric ammino-hydroxide and cupric ammonium carbonate,   (b) heating said solution in a system closed to the atmosphere under conditions of controlled time, temperature and pressure to remove water, effect polymerization of said salt and provide said polymer in the molten state, wherein said solution contains sufficient KI and/or KBr to provide at least 500 ppm by weight thereof in said polymer and sufficient copper complex to provide at least 30 ppm by weight of copper in said polymer.   
     
     
       2. The process of claim 1 wherein the concentration of said nylon 66 salt in said aqueous solutions is between 45% and 75%. 
     
     
       3. The process of claim 2 wherein said solution contains a sufficient amount of said copper complex to provide from 50 to 100 ppm by weight of copper in the final polymer. 
     
     
       4. The process of claim 3 wherein said copper complex is cupric ammino-hydroxide.