US4895756AExpiredUtilityPatentIndex 82
Printed circuit substrate
Est. expiryNov 20, 2007(expired)· nominal 20-yr term from priority
Inventors:SUZUKI HIROSUKE
H05K 1/162H05K 1/167B23Q 3/02H05K 2203/1461Y10T428/30Y10T428/31544Y10S428/901H05K 1/0353H05K 2201/086H05K 2201/09563H05K 3/4069H01C 7/22H05K 2201/015Y10T428/25H05K 2201/0323Y10T428/24999H05K 2201/0209H05K 2201/0376Y10T428/249986H05K 2201/0116H05K 2201/0187
82
PatentIndex Score
18
Cited by
4
References
10
Claims
Abstract
A printed circuit is provided wherein the electrically conductive material which forms the circuit elements is embedded within a dielectric substrate. The preferred dielectric substrate is porous, expanded polytetrafluoroethylene.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A printed circuit comprising electrically conductive material which forms circuit elements contained within the pores of a porous dielectric substrate.
2. The circuit of claim 1 wherein said conductive material is a low-conductivity material which forms a resistor.
3. The circuit of claim 1 wherein said conductive material is a high-dielectric constant material which forms a capacitor.
4. The circuit of claim 1 wherein said conductive material is a material having high magnetic permeability.
5. The printed circuit of claim 1 wherein said dielectric substrate is a porous dielectric material.
6. The printed circuit of claim 5 wherein said dielectric substrate is a porous dielectric material having continuous pores therethrough.
7. The printed circuit of claim 5 wherein said dielectric substrate is porous, expanded polytetrafluoroethylene.
8. The printed circuit of claim 1 wherein said conductive material is electrically conductive.
9. The printed circuit of claim 1 wherein said conductive material is light conducting.
10. The circuit of claim 1 wherein said conductive material is impregnated within said dielectric substrate.Cited by (0)
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References (0)
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