Method for producing copper film-formed articles

Abstract

A method for producing a copper film-formed molding is disclosed, comprising a coating a mixed solution containing at least one copper compound selected from copper hydroxide and organic acid copper salts and a polyhydric alcohol as essential components on the desired area of an article having a heat deflection temperature of at least 165° C., and heating to a temperature of from 165° C. to the heat deflection temperature of the article and maintaining at this temperature in a non-oxidizing atmosphere.

We claim: 
     
       1. A method for producing a copper film-formed molding which comprises coating a mixed solution consisting essentially of a copper compound selected from the group consisting of copper hydroxide and organic acid copper salts and a polyhydric alcohol on the desired area of an article having a heat deflection temperature of at least 165° C., and then heating and maintaining the article at a temperature of from 165° C. to the heat deflection temperature of the article in a nonoxidizing atmosphere, wherein the mixed solution consists essentially of 10 to 70% by weight of the copper compound and 90 to 30% by weight of the polyhydric alcohol. 
     
     
       2. The method as claimed in claim 1, wherein the copper compound is at least one copper compound selected from the group consisting of copper hydroxide, copper formate and copper acetate. 
     
     
       3. The method as claimed in claim 1, wherein the polyhydric alcohol is glycerine.