Copper foil for a printed circuit and a method for the production thereof

Abstract

A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.

I claim: 
     
       1. A copper-clad laminated board for preparing a printed circuit consisting of a highly electroconductive pattern which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer 0.02 to 0.2 micron thick consisting essentially of a phosphorus-containing nickel layer formed by electro-desposition, said substrate being in face-to-face contact with said bonding surface of said copper foil, said nickel layer containing 0.05 to 10% by weight of phosphorus and being easily etchable with an ammonium persulfate etching solution. 
     
     
       2. The copper clad laminated board of claim 1, wherein said nickel layer contains from 1 to 8.7% phosphorus. 
     
     
       3. The copper clad laminated board of claim 1, wherein said nickel layer contains from 2 to 8% phosphorus. 
     
     
       4. The copper clad laminated board of claim 1, wherein said nickel layer contains from 2 to 7% phosphorus.