Temperature sensor construction

Abstract

A temperature sensor construction suitable for use in mechanically oscillating systems features a protective tube 8 containing a temperature sensor 11, a springy carrier board 1 with conductive tracks 2,3 and terminals 4,5,6,7 for a signal transmission conductor. The carrier 1 is mounted, under spring tension, facing the inner surface of the protective tube 8. The conductive tracks preferably run parallel to the axis of the protective tube and have contacts 4,5 at one end for connection to the temperature sensor 11 and contacts 6,6',7,7' at the other end for connection to the signal transmission leads 12, 12', 13, 13'.

I claim: 
     
       1. Temperature sensor construction resistant to audio frequency resonance vibrations, comprising a protective tube (8);   a thin, elongated carrier of elastic material (1) mounted in a bowed orientation inside said protective tube (8), in order to resist said resonance vibrations;   a plurality of pairs of conductive tracks (2, 3) formed on said carrier (1) and extending generally parallel to a central axis of said tube, thereby defining first and second ends of each track;   a respective contact (4, 5) formed at first ends of each respective pair of said tracks (2, 3) for connection of a respective lead of a temperature sensor (11); and   contacts (6, 6', 7, 7') formed at second ends of said tracks (2, 3) for connection of leads (12, 12', 13, 13') of a signal transmission cable,   said bowed orientation of said elastic carrier (1) tending to reduce vulnerability, of said connections between leads and contacts, to disconnection resulting from carrier oscillations.   
     
     
       2. Temperature sensor construction according to claim 1, wherein said elastic carrier (1) is a board having at least one insulating surface, and   said conductive tracks (2, 3) comprise at least one layer applied to said insulating surface.   
     
     
       3. Temperature sensor construction according to claim 2, wherein said conductive tracks (2, 3) comprise at least two superimposed metal layers.   
     
     
       4. Temperature sensor construction according to claim 1, wherein said carrier (1) is stable at temperatures up to at least 180° C.   
     
     
       5. Temperature sensor construction according to claim 4, wherein said carrier (1) consists essentially of a material selected from the group consisting of   epoxy resin, polytetrafluoroethylene, and polyimide.   
     
     
       6. Temperature sensor construction according to claim 1, wherein said conductive tracks (2, 3) comprise a layer consisting essentially of a material selected from the group consisting of   copper, aluminum, a copper alloy, and an aluminum alloy.   
     
     
       7. Temperature sensor construction according to claim 2, wherein said conductive tracks (2, 3) comprise a layer consisting essentially of a material selected from the group consisting of   copper, aluminum, a copper alloy, and an aluminum alloy.   
     
     
       8. Temperature sensor construction according to claim 3, wherein said conductive tracks (2, 3) comprise a layer consisting essentially of a material selected from the group consisting of   copper, aluminum, a copper alloy, and an aluminum alloy.   
     
     
       9. Temperature sensor construction according to claim 4, wherein said conductive tracks (2, 3) comprise a layer consisting essentially of a material selected from the group consisting of   copper, aluminum, a copper alloy, and an aluminum alloy.   
     
     
       10. Temperature sensor construction according to claim 5, wherein said conductive tracks (2, 3) comprise a layer consisting essentially of a material selected from the group consisting of   copper, aluminum, a copper alloy, and an aluminum alloy.