Thermosetting resin composition composed of a polymaleimide compound, a phenolic novolac resin and an epoxy resin

Abstract

A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

What is claimed is: 
     
       1. A thermosetting resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a cresol novolac resin of which phenolic hydroxyl groups are allyl-etherified, and an epoxy resin, the quantitative ratio of the double bonds of the allyl-etherified cresol novolac resin and of the polymaleimide compound is in the range of 0.3 to 3.0, and said epoxy resin is used in an amount of 5 to 200 parts per 100 parts by weight of the allyletherified cresol novolac resin. 
     
     
       2. A thermosetting resin composition according to claim 1, wherein said polymaleimide compound is a compound having two or more maleimide groups represented by the following general formula (I) in one molecule: ##STR2## wherein R represents hydrogen atom or lower alkyl group having 1 to 5 carbon atoms. 
     
     
       3. A thermosetting resin composition according to claim 1, wherein said polymaleimide compound is N,N'-diphenylmethane bismaleimide or N,N'-diphenyl ether bismaleimide. 
     
     
       4. A thermosetting resin composition according to claim 1, wherein said epoxy resin is an epoxy resin obtained from epichlorohydrin and Bisphenol A, tetrabromoBisphenol A, Bisphenol F, Bisphenol S, phenol novolac, cresol novolac, resorcin, hydroquinone, 4,4'-diaminodiphenylmethane, aminophenol, aminocresol, polypropylene glycol or pentaerythritol.