US5104728AExpiredUtility
Ultrasonically bonded fabric and method of making same
Est. expiryJan 22, 2008(expired)· nominal 20-yr term from priority
Y10T442/69Y10T442/674D04H 1/544D04H 1/555Y10T428/31663
51
PatentIndex Score
16
Cited by
2
References
4
Claims
Abstract
An ultrasonically bonded fabric comprising a non-woven coverstock treated with an organosilicone material, e.g., an organosilicone fluid, prior to being ultrasonically bonded to another material. The ultrasonically bonded fabric as made by treating a non-woven coverstock with the organosilicone material and ultrasonically bonding the treated non-woven coverstock to the other material.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. An ultrasonically bonded fabric comprising a non-woven coverstock that is ultrasonically bonded to an anti-wetness material wherein an absorbent material is positioned between the coverstock and the anti-wetness material and wherein the coverstock is treated with an organosilicone material prior to being ultrasonically bonded to the anti-wetness material to prevent failure of the fabric.
2. A disposable device for absorbing and containing liquids comprising a liquid permeable coverstock bonded to a liquid impermeable back sheet to enclose an absorbent element therebetween, said liquid permeable coverstock having dispersed thereon an organosilicone surfactant.
3. The disposable device as claimed in claim 2 wherein the organosilicone is dispersed in an amount of 0.001 to 0.004 g/m 2 of said liquid permeable coverstock.
4. The disposable device as claimed in claim 2, wherein said organosilicone material is an organomodified polydimethylsiloxane.Join the waitlist — get patent alerts
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