Cleaning compositions

Abstract

Improved cleaning compositions are disclosed based on fluorochlorohydrocarbons, alkanols and at least one ester selected from the group consisting of methyl propionate, ethyl propionate and ethyl acetate. The compositions may optionally contain additional additives and are highly suitable for industrial cleaning processes or for vapor degreasing, for example, particularly for removing resin soldering fluxes containing high amounts of activator.

What is claimed is: 
     
       1. A composition consisting essentially of from 97.5 to 89.0 wt-% of a fluorochlorohydrocarbon with 1 or 2 carbon atoms selected from the group consisting of trichlorofluoromethane, the tetrachlorodifluoroethanes, the trichlorotrifluoroethanes, the dichlorotrifluoroethanes, and the dichloromonofluoroethanes, from 2.0 to 8.0 wt-% of an alkanol with 1 to 4 carbon atoms, and from 0.5 to 3 wt-% of an ester selected from the group consisting of ethyl propionate, methyl propionate and ethyl acetate. 
     
     
       2. A composition according to claim 1, wherein said fluorochlorohydrocarbon has a boiling point in the range from 20° C. to 120° C. 
     
     
       3. A compositions according to claim 1, wherein said fluorochlorohydrocarbon with 1 to 2 carbon atoms is selected from the group consisting of trichlorofluoromethane (R11), 1,1,2,2-tetrachloro-1,2-difluoroethane (R112), 1,1,2-trichloro-1,2,2-trifluoroethane (R113), 1,1-dichloro-2,2,2-trifluoroethane (R123), and 1,1-dichloro-1-fluoroethane (R141b). 
     
     
       4. A composition according to claim 1, wherein said alkanol is selected from the group consisting of methanol, ethanol, isopropanol, n-propanol, n-butanol, sec.-butanol and tert.-butanol. 
     
     
       5. A composition according to claim 4, wherein said alkanol is selected from the group consisting of methanol, ethanol and isopropanol. 
     
     
       6. A composition according to claim 1, consisting of essentially of an azeotropic mixture of about 94.2 wt-% 1,1,2-trichloro-1,2,2-trifluoroethane (R113), 3.5 wt-% ethanol and 2.3 wt-% ethyl acetate having a boiling point of approximately 44.3° C. 
     
     
       7. A composition according to claim 1, further containing from about 0.01 to 5 wt-% of a stabilizer, relative to the total weight of the composition. 
     
     
       8. A composition according to claim 7, containing from about 0.05 to 1 wt-% stabilizer, relative to the total weight of the composition. 
     
     
       9. A composition according to claim 7, wherein said stabilizer is selected from the group consisting of nitroalkanes, alkylene oxides and alkynols. 
     
     
       10. A method of cleaning an article comprising contacting said article with a composition according to claim 1. 
     
     
       11. A method according to claim 10, whereins said contacting is effected by immersing the article to be cleaned in said composition. 
     
     
       12. A method according to claim 10, wherein said contacting is effected by spraying said composition on the article. 
     
     
       13. A method of vapor degreasing an article comprising subjecting an article to be vapor degreased to the vapors of a composition according to claim 1. 
     
     
       14. A method of removing soldering flux or soldering flux residue from the surface of a printed circuit board contaminated therewith, said method comprising contacting the surface of said printed circuit board with a composition according to claim 1.