Apparatus for solder joining metal tapes

Abstract

An apparatus for solder joining metal tapes to form laminated metal tapes comprises an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box. The tapered channel having an entrance end and narrowing to an exit end. At least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end. The sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops. The base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes. A second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes. A solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end. The solder duct means having a slot extending therethrough and aligned with the exit end. A seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom, and a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.

What is claimed is: 
     
       1. An apparatus for solder joining at least two metal tapes having a length, width, and thickness dimension in a continuous laminating apparatus to form a laminated metal tape comprising: an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box, the tapered channel having an entrance end and narrowing to an exit end, at least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end, the sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels mounted on the wall tops, the base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes, a second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tape;   a solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end, the solder duct means having a slot extending therethrough and aligned with the exit end that is larger than the cross-section of the laminated tape;   a seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom; and   a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.   
     
     
       2. An apparatus for solder joining at least two metal tapes having a length, width, and thickness dimension in a continuous laminating apparatus to form laminated metal tapes comprising: an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box, the tapered channel having an entrance end and narrowing to an exit end, at least one tapered wall extending from the base and within the inner channel to define subchannels that are spaced at the entrance end and converge into the inner channel before the exit end, the sidewall means and tapered wall extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops, the base, sidewalls, inner wall, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes, a second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes;   a solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end, the solder duct means having a slot extending therethrough and aligned with the exit end, and drain means for collecting and draining molten solder flowing from the entrance end;   a seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom; and   a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.   
     
     
       3. An apparatus according to claim 2 wherein the base has at least two bores extending therethrough and in communication with the solder duct means to direct molten solder into the inner channel so that the molten solder wets both surfaces of tapes passing through the channel and subchannels. 
     
     
       4. An apparatus according to claim 3 wherein the bores are positioned between the sidewalls and inner wall, having a diameter larger than the distance between oppositely facing walls and extending from the base to the wall top as aligned concave surfaces on the walls. 
     
     
       5. An apparatus according to claim 2 comprised of a second drain means mounted on the duct means and positioned between the seal means and wiper means for draining solder passing from the seal means, the second drain means having heating means for maintaining a preselect temperature therein. 
     
     
       6. An apparatus according to claim 2 comprised of a heating means on the housing for maintaining the housing at a preselected temperature. 
     
     
       7. An apparatus according to claim 2 comprised of enclosing means for providing a preselected atmosphere over the alignment box and means for collecting molten solder flowing from the entrance end. 
     
     
       8. An apparatus according to claim 2 wherein the seal means and wiper means are compliant so that small particles having minimal effect on the tape performance can pass therethrough. 
     
     
       9. An apparatus according to claim 8 wherein the seal means and wiper means are formed from silicone rubber having a durometer hardness of at least about shore A 40, and resistant to temperatures of at least about 250° C. 
     
     
       10. An apparatus according to claim 2 wherein the seal means is a sheet having a slit aligned with the exit end. 
     
     
       11. An apparatus for solder joining metal tapes having a length, width, and thickness dimension in a continuous laminating apparatus to form laminated metal tapes comprising: an alignment box having a base and a sidewall means extending therefrom to define a tapered inner channel extending through the box, the tapered channel having an entrance end and narrowing to an exit end, two tapered walls extending from the base and within the inner channel to define three subchannels that are spaced at the entrance end and converge into the inner channel before the exit end, the sidewall means and tapered walls extending from the base to respective wall tops, and a cover extending over the channel and subchannels is mounted on the wall tops, the base, sidewalls, inner walls, and cover being configured to form the channel and subchannels to have a first preselected distance between the base and cover that is greater than the width of the tapes, a second preselected distance between oppositely facing walls bordering the subchannels that is greater than the thickness of the tapes, and a third preselected distance between oppositely facing walls at the exit end that is greater than the thickness of the laminated tapes;   a solder duct means mounted on the box for directing molten solder into the inner channel to flow from the exit end to the entrance end, the solder duct means having a slot extending therethrough and aligned with the exit end that is larger than the cross-section of the laminated tape, and drain means for collecting and draining molten solder flowing from the entrance end;   a seal means mounted on the solder duct means adjacent the slot for minimizing solder escaping from the slot while solder coated tapes pass therefrom; and   a wiper means mounted on the solder duct means and positioned from the seal means removes excess solder from tapes passing through the seal means.