Integrated circuit device and manufacturing method thereof

Abstract

Provided is an integrated circuit device is used in an IC card or the like, and a manufacturing method of the integrated circuit device, having a thin thickness so as to be capable of being manufactured highly accurately in dimensions and highly efficiently. The integrated circuit element (12) is mounted on one surface of the thin metal plates (11) having the other surface which at least part serves as a plurality of external connecting terminals (11a) and, on one surface side, the integrated circuit element (12) is covererd with a sealing resin (15).

What is claimed is: 
     
       1. An integrated circuit card comprising an integrated circuit device packaged in a well which is formed in a first side of a plastic card and which has bottom corner parts, said integrated circuit device comprising thin metal plates arranged substantially in one and the same plane with predetermined spaces therebetween and each having a first surface and a second surface, said first surface constituting an external connecting terminal and providing a portion of an outermost boundary of said integrated circuit card at said first side of said plastic card without extending beyond a plane defined by said first side of said plastic card; an integrated circuit element bonded to at least one of said thin metal plates at said second surface by means of an adhesive and having input/output electrodes; electrical connection means for connecting said input/output electrodes to said second surface; and a sealing molding resin having a first side and second side, for covering said electrical connection means and said integrated circuit element on said first side, said sealing molding resin having corners on said second side each being rounded to provide a curved corner surface, said sealing molding resin having a shape to enable it to be closely fitted in said well in said plastic card, whereby said rounded corners prevent said plastic card from being damaged at said corner parts event said plastic card is bent or curved. 
     
     
       2. An integrated circuit card as set forth in claim 1, wherein said external connection terminals of said thin metal plates provide input/output electrodes for an IC card. 
     
     
       3. An integrated circuit card as set forth in claim 1, wherein said second surface of each of said thin metal plates has an area which is greater than that of said first surface thereof. 
     
     
       4. An integrated circuit card comprising an integrated circuit device packaged in a well which is formed in a first side of a plastic card and which has bottom corner parts, said integrated circuit device comprising thin metal plates arranged substantially in a plane defined by said first side of said card, said thin metal plates having predetermined spaces therebetween and each having a first surface and a second surface, said first surface constituting an external connecting terminal; and integrated circuit element bonded to at least one of said thin metal plates at said second surface by means of an adhesive and having input/output electrodes; electrical connection means for connecting said input/output electrodes to said second surface; and sealing molding resin having a first side and second side, for covering said electrical connection means and said integrated circuit element on said first side, said sealing molding resin having corners on said second side each being rounded to provide a curved corner surface, said sealing molding resin having a shape to enable it to be closely fitted in said well in said plastic card, whereby said rounded corners prevent said plastic card from being damaged at said corner parts even said plastic card is bent or curved.