Metallic composition and methods for making and using the same

Abstract

The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi 2 . The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi 2 , about 5% to about 20% Cu and up to about 20% by weight Mn.

What is claimed is: 
     
       1. A paste composition for forming an electrically conductive path upon a dielectric substrate, said paste composition comprising at least one organic vehicle and a metallic powder, said metallic powder comprising about 60% to about 90% by weight molybdenum (Mo) and about 0.5% to about 15% by weight silicon (Si). 
     
     
       2. A paste as set forth in claim 1 wherein said metallic powder comprises about 0.5% to about 15% by weight MoSi 2 . 
     
     
       3. A paste as set forth in claim 1 wherein said metallic powder includes copper (Cu) and up to about 20% by weight Mn. 
     
     
       4. A paste as set forth in claim 1 wherein said metallic powder comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi 2 , about 5% to about 20% by weight Cu and up to about 20% by weight Mn. 
     
     
       5. A paste as set forth in claim 1 wherein said metallic powder comprises about 80% to about 88% by weight of said paste. 
     
     
       6. A paste as set forth in claim 1 wherein said organic vehicle comprises a binder. 
     
     
       7. A paste as set forth in claim 1 wherein said organic vehicle comprises a solvent. 
     
     
       8. A method of producing a paste for use in forming an electrically conductive path upon a dielectric substrate, said method comprising the steps of: (A) milling manganese (Mn), molybdenum (Mo) and silicon (Si) in the presence of a solvent so as to produce a solvent-laden metallic powder, the metallic portion of such solvent-laden metallic powder comprising about 60% to about 90% by weight Mo and about 0.5% to about 15% by weight Si and up to about 20% by weight Mn;   (B) drying such solvent-laden metallic powder; and   (c) adding at least one organic vehicle to such metallic powder so as to produce such paste.   
     
     
       9. A method of producing a paste as set forth in claim 8 wherein during said step (A) such Mn, Mo and Si are milled to produce such solvent-laden metallic powder having an average particle size of less than about 2 microns. 
     
     
       10. A method of producing a paste as set forth in claim 8 wherein such organic vehicle comprises a binder and a solvent. 
     
     
       11. A method of producing a paste as set forth in claim 10 wherein such binder comprises ethylcellulose and such solvent comprises terpineol. 
     
     
       12. A method of producing a paste as set forth in claim 8 wherein during said step (A) copper (Cu) is milled in conjunction with such Mn, Mo and Si. 
     
     
       13. A method of producing a paste for use in forming an electrically conductive path upon a dielectric substrate, said method comprising the step of mixing a metallic powder with at least one organic vehicle, such metallic powder comprising about 60% to about 90% by weight molybdenum (Mo), about 0.5% to about 15% by weight silicon (Si), up to about 20% by weight Mn, and about 5% to about 20% by weight copper (Cu).