Matched impedance vertical conductors in multilevel dielectric laminated wiring

Abstract

Electrical impedance matching for through plane connections or vias in a multiplane laminated wiring structure is provided by arranging the vias in patterns conforming to a standard characteristic impedance configuration. The pattern may be a five wire configuration with four vias surrounding the fifth and repeated over the area of the plane.

Having thus described my invention, what I claim as new and desire to secure by letters patent is: 
     
       1. An electrical wiring structure comprising in combination, a plurality of superimposed planes of x and y direction electrical wiring conductors, each plane of said electrical wiring conductors being separated by a layer of dielectric material from a parallel plane of broad area reference potential conductive material,     at least one z direction wiring conductor interconnecting via member passing through at least one said layer of dielectric material and interconnecting at least one said wiring conductor in one plane with at least one said wiring conductor in at least one other plane,   each said via member being a conductor configuration comprising a central signal member surrounded by, and equidistant from, equidistant peripheral reference potential members,   said central signal member and surrounding reference potential member configuration further having a member size and member position relationship for defining a specific electrical characteristic impedance and,   each portion of said broad area reference potential conductor material enclosed by said peripheral members being free of reference potential conductive material.   
     
     
       2. The electrical wiring structure of claim 1 wherein in each said portion that is free of reference potential conductive material there is positioned a conductor width strip of conductive material adjacent any single underlying conductor separated by a single dielectric layer. 
     
     
       3. The wiring structure of claim 1 wherein there are four equidistant peripheral members. 
     
     
       4. The wiring structure of claim 3 wherein said dielectric of said dielectric layers are of coalesced glass ceramic. 
     
     
       5. An electrical wiring module exhibiting electrical transmission line characteristic impedance properties in all of x, y, and z directions comprising in combination,   superimposed planes of x and y direction conductors, the conductors in each direction being supported by a dielectric layer that separates the conductors from a parallel plane of reference potential conductive material,and,   at least one connection in the z direction joining at least one said conductor in one said plane with at least one said conductor in another of said planes, said z direction connection being a spaced configuration of a central signal element equally spaced from equally spaced peripheral reference potential elements,   said peripheral reference potential elements surrounding a portion of a plane of reference potential conductive material that is free of reference potential conductive material, and   said peripheral reference potential elements having a size and position relationship for defining a specific electrical characteristic impedance.     
     
     
       6. The electrical wiring module of claim 5 wherein in each said portion of a plane of reference potential conductive material that is free of conductive material there is positioned a conductor width strip of conductive material adjacent any single underlying conductor separated by a single dielectric layer. 
     
     
       7. In the electrical wiring module of claim 6 said dielectric being of glass ceramic material.