Lsi cooling apparatus and computer cooling apparatus

Abstract

An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.

What is claimed is: 
     
       1. An LSI cooling apparatus for cooling LSIs by flowing a fluid through heat sinks attached to the LSIs, each of said heat sinks comprising a group of a plurality of thin-wire fins, said group of thin-wire fins being aligned in parallel with each other in a plane and being bent in a corrugated shape,   said group of thin wire fins including a plurality of wide-width members, each of the wide-width members having a cross section of a width wider than a width of the thin-wire fins,   each of said wide-width member being disposed at a predetermined interval from another wide-width member.   
     
     
       2. An LSI cooling apparatus according to claim 1, wherein a sectional shape of each of said thin-wire fins is selected from the group consisting of a circle, an ellipse, and a rectangle. 
     
     
       3. An LSI cooling apparatus according to claim 1, wherein, a diameter of a thin-wire fin of the tin-wire fins, a fluid sending rate of the flow corresponding to a passage of fluid for guiding the flow are such that a Reynold's number defined by ##EQU1## is less than 40, wherein d is the diameter of the wire, V is the flow velocity of the fluid flowing through said heat sinks and ν is the coefficient of kinematic viscosity of the fluid.   
     
     
       4. An LSI cooling apparatus according to claim 3, wherein said diameter of the thin wire is less than 0.6 mm. 
     
     
       5. A computer cooling apparatus, comprising: a board including plural LSI packages, said LSI packages having heat sinks;   air sensing means for sending air to cool said LSI packages through an air passage of the air sending means,   each of said heat sinks including thin-wire fins, the diameter of a thin wire of the thin wire fins, and the air sending rate being so set as to yield a Reynold's number less than 40,   wherein said air passage includes a guide plate for dividing air into a main flow and a bypass flow and said main flow is guided by a slit formed in said guide plate so that the main flow collide with a portion of said LSI packages from above whereas a remaining portion of said LSI packages are adapted to be cooled by said bypass flow.