Epoxy acrylate resins and photosensitive resin compositions therefrom

Abstract

Epoxy acrylate resins of this invention having a structure of the general formula (I) ##STR1## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20 are heat-resistant, solvent-soluble, and photosensitive and photosensitive resin compositions containing said epoxy acrylate resins as main component exhibit high photosensitivity in addition to strong adhesion to substrates, good resistance to heat and chemicals, and good mechanical and electrical properties and are useful as materials for forming insulation films for multilayer devices and protective films for image sensors and as protective films for solder resists, plating resists, and color filters.

What is claimed is: 
     
       1. Epoxy acrylate resins represented by the general formula (I) ##STR6## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20. 
     
     
       2. Photosensitive resin compositions characterized by containing 15 to 90% by weight of epoxy acrylate resins of the general formula (I) ##STR7## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20 and 10 to 85% by weight of at least one compound selected from trifunctional and higher acrylates and epoxy acrylates. s