Packaging electrical components

Abstract

A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to the circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.

What is claimed is: 
     
       1. A package for electrical components, comprising a circuit board for holding the electrical components,   an enclosure having generally parallel, spaced apart upper and lower internal surfaces, the circuit board lying generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface,   conductive terminal pins extending from outside the enclosure into the internal space, and   conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space and connected to one of the terminal pins.   
     
     
       2. The package of claim 1 wherein said links have portions that comprise flat metal pieces. 
     
     
       3. The package of claim 1 wherein said links have portions that perpendicular to the board. 
     
     
       4. The package of claim 1 wherein said enclosure comprises a base bearing the lower internal surface and a case bearing the upper internal surface. 
     
     
       5. The package of claim 4 wherein said base comprises a thermally conductive plate. 
     
     
       6. The package of claim 5 further comprising a power-dispensing component mounted ton the plate. 
     
     
       7. The package of claim 4 wherein said case comprises an upper wall bearing said upper internal surface, and a step connected by a transition to the upper wall, and the pins pass through the step.   
     
     
       8. The package of claim 1 wherein said pins extend through the upper internal surface. 
     
     
       9. The package of claim 1 wherein some of the links have a broader conductive connection to the board than other links. 
     
     
       10. The package of claim 7 wherein the pins are spaced a sufficient distance from the transition to allow the pins and the upper wall to pass through respective distinct holes in an external circuit board. 
     
     
       11. The package of claim 7 wherein the transition portion is sloped. 
     
     
       12. The package of claim 7 further comprising a ferrite ring lying around one of said pins adjacent the step. 
     
     
       13. The package of claim 1 wherein the another end of each link which projects into an internal space has a portion bent to extend parallel to the circuit board, and the pins are connected to the bent portions. 
     
     
       14. The package of claim 13 wherein one of the electrical components lies between the circuit board and one of the bent portions. 
     
     
       15. The package of claim 1 wherein one of said links extends around a corner of the circuit board. 
     
     
       16. The package of claim 1 comprising two sets of the links arranged respectively along opposite peripheral edges of the circuit board. 
     
     
       17. A method for connecting terminal pins to a circuit board, comprising providing an electrically conductive fence having at least two conductive links joined by a severable junction,   providing a bent portion on each conductive link,   attaching a terminal pin to the bent portion of each link,   attaching the fence at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the bent portion of each link lying generally parallel to and spaced apart from the circuit board, and   severing the severable junction.   
     
     
       18. The method of claim 17 further comprising mounting the circuit board on a base, and   attaching a case to the base with the pins partially extending through the case.   
     
     
       19. The method of claim 18 further comprising inserting a resilient encapsulant in the internal space defined by the base and the case. 
     
     
       20. The method of claim 18 further comprising: mounting conductive pads on a substrate,   mounting a power-dissipating device on the substrate,   forming electrical connections from the pads to the power-dissipating device,   mounting the substrate on the base,   placing the circuit board over the substrate such that the power-dissipating device lies in an aperture formed in the circuit board and the circuit board contacts the substrate, and   electrically connecting the circuit board and the power-dissipating component by soldering the pads to the circuit board.